SBVS338H March   2020  – July 2024 TPS7A20

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Low Output Noise
      2. 6.3.2 Smart Enable
      3. 6.3.3 Dropout Voltage
      4. 6.3.4 Foldback Current Limit
      5. 6.3.5 Undervoltage Lockout (UVLO)
      6. 6.3.6 Thermal Shutdown
      7. 6.3.7 Active Discharge (P Version Only)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Load Transient Response
      4. 7.1.4 Undervoltage Lockout (UVLO) Operation
      5. 7.1.5 Power Dissipation (PD)
        1. 7.1.5.1 Estimating Junction Temperature
        2. 7.1.5.2 Recommended Area for Continuous Operation
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision G (May 2022) to Revision H (July 2024)

  • Changed Packages bullet in Features for clarificationGo
  • Changed title of Application Schematic figureGo
  • Deleted discussion of pulldown resistor from OUT pin description in YCJ and YCK package Pin Functions tableGo
  • Added clarification to Active Discharge (P Version Only) section that this feature only applies to the P device versionGo
  • Changed active output discharge feature discussion in Device Nomenclature tableGo

Changes from Revision F (April 2022) to Revision G (May 2022)

  • Changed UVLO condition from rising to falling for YCJ and YCK packages.Go