SBVS298B September   2017  – July 2018 TPS7A53-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Powering RF Components
      2.      Output Voltage Noise vs Frequency and Output Voltage
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Regulation Features
        1. 7.3.1.1 DC Regulation
        2. 7.3.1.2 AC and Transient Response
      2. 7.3.2 System Start-Up Features
        1. 7.3.2.1 Programmable Soft Start (NR/SS Pin)
        2. 7.3.2.2 Internal Sequencing
          1. 7.3.2.2.1 Enable (EN)
          2. 7.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 7.3.2.2.3 Active Discharge
        3. 7.3.2.3 Power-Good Output (PG)
      3. 7.3.3 Internal Protection Features
        1. 7.3.3.1 Foldback Current Limit (ICL)
        2. 7.3.3.2 Thermal Protection (Tsd)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Regulation
      2. 7.4.2 Disabled
      3. 7.4.3 Current Limit Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Recommended Capacitor Types
        1. 8.1.1.1 Input and Output Capacitor Requirements (CIN and COUT)
        2. 8.1.1.2 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
        3. 8.1.1.3 Feed-Forward Capacitor (CFF)
      2. 8.1.2  Soft Start and Inrush Current
      3. 8.1.3  Optimizing Noise and PSRR
      4. 8.1.4  Charge Pump Noise
      5. 8.1.5  Current Sharing
      6. 8.1.6  Adjustable Operation
      7. 8.1.7  Power-Good Operation
      8. 8.1.8  Undervoltage Lockout (UVLO) Operation
      9. 8.1.9  Dropout Voltage (VDO)
      10. 8.1.10 Device Behavior During Transition From Dropout Into Regulation
      11. 8.1.11 Load Transient Response
      12. 8.1.12 Reverse Current Protection Considerations
      13. 8.1.13 Power Dissipation (PD)
      14. 8.1.14 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
      2. 10.1.2 RTK Package — High CTE Mold Compound
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Reference Designs
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGR|20
  • RTK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating junction temperature range (TJ = –40°C to +150°C), VIN = 1.4 V or VIN = VOUT(nom) + 0.4 V (whichever is greater), VBIAS = open, VOUT(nom) = 0.8 V(1), OUT connected to 50 Ω to GND(2), VEN = 1.1 V, CIN = 10 µF, COUT = 47 µF, CNR/SS = CFF = open, and PG pin pulled up to VIN with 100 kΩ (unless otherwise noted); typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback voltage 0.8 V
VNR/SS NR/SS pin voltage 0.8 V
VUVLO1+(IN) Rising input supply UVLO with BIAS VIN rising with VBIAS = 3.0 V 1.02 1.09 V
VHYS1(IN) VUVLO1(IN) hysteresis VBIAS = 3.0 V 320 mV
VUVLO1-(IN) Falling input supply UVLO with BIAS VIN falling with VBIAS = 3.0 V 0.55 0.711 V
VUVLO2+(IN) Rising input supply UVLO without BIAS VIN rising 1.31 1.39 V
VHYS2(IN) VUVLO2(IN) hysteresis 253 mV
VUVLO2-(IN) Falling input supply UVLO without BIAS VIN falling  0.65 1.064 V
VUVLO+(BIAS) Rising bias supply UVLO VBIAS rising, VIN = 1.1 V 2.83 2.9 V
VUVLO-(BIAS) Falling bias supply UVLO VBIAS falling, VIN = 1.1 V 2.45 2.531 V
VHYS(BIAS) VUVLO(BIAS) hysteresis VIN = 1.1 V 290 mV
VOUT Output voltage Range Using external resistors(3) 0.8 5.15 V
Accuracy 0.8 V ≤ VOUT ≤ 5.15 V, 5 mA ≤ IOUT ≤ 3 A, over VIN,  –40℃ < TJ < 150℃ –2% 1%  
Accuracy with BIAS VIN = 1.1 V, 5 mA ≤ IOUT ≤ 3 A,3.0 V ≤ VBIAS ≤ 6.5 V, –40℃ < TJ < 150℃ –1.75% 0.75%
Accuracy 0.8 V ≤ VOUT ≤ 5.15 V, 5 mA ≤ IOUT ≤ 3 A, over VIN, –40℃ < TJ < 125℃ –1% 1%
Accuracy with BIAS VIN = 1.1 V, 5 mA ≤ IOUT ≤ 3 A,
3.0 V ≤ VBIAS ≤ 6.5 V, –40℃ < TJ < 125℃		 –0.75% 0.75%
ΔVOUT/ ΔVIN Line regulation IOUT = 5 mA, 1.4 V ≤ VIN ≤ 6.5 V 0.0035 mV/V
ΔVOUT/ ΔIOUT Load regulation 5 mA ≤ IOUT ≤ 3 A, 3.0 V ≤ VBIAS ≤ 6.5 V,
VIN = 1.1 V		 0.07 mV/A
5 mA ≤ IOUT ≤ 3 A 0.08
5 mA ≤ IOUT ≤ 3 A, VOUT = 5.0 V 0.04
VDO Dropout voltage RGR package VIN = 1.4 V, IOUT = 3 A, VFB = 0.8 V – 3% 157 285 mV
VIN = 5.4 V, IOUT = 3 A, VFB = 0.8 V – 3% 215 370
VIN = 5.6 V, IOUT = 3 A, VFB = 0.8 V – 3% 255 475
VIN = 1.1 V, 3.0 V ≤ VBIAS ≤ 6.5 V, 
IOUT = 3 A, VFB = 0.8 V – 3%		 110 195
RTK package VIN = 1.4 V, IOUT = 3 A, VFB = 0.8 V – 3% 170 310
VIN = 5.4 V, IOUT = 3 A, VFB = 0.8 V – 3% 241 415
VIN = 5.6 V, IOUT = 3 A, VFB = 0.8 V – 3% 291 515
VIN = 1.1 V, 3.0 V ≤ VBIAS ≤ 6.5 V, 
IOUT = 3 A, VFB = 0.8 V – 3%		 126 220
ILIM Output current limit VOUT forced at 0.9 × VOUT(nom),
VIN = VOUT(nom) + 0.4 V		 3.55 4.2 4.9 A
ISC Short-circuit current limit RLOAD = 20 mΩ 1.0 A
IGND GND pin current VIN = 6.5 V, IOUT = 5 mA 3 4 mA
VIN = 1.4 V, IOUT = 3 A 4.3 5.5
Shutdown, PG = open, VIN = 6.5 V, VEN = 0.5 V 25 µA
IEN EN pin current VIN = 6.5 V, VEN = 0 V and 6.5 V –0.5 0.5 µA
IBIAS BIAS pin current VIN = 1.1 V, VBIAS = 6.5 V,
VOUT(nom) = 0.8 V, IOUT = 3 A		 2.4 3.5 mA
VIL(EN) EN pin low-level input voltage
(disable device)		 0.5 V
VIH(EN) EN pin high-level input voltage
(enable device)		 1.1 V
VIT-(PG) PG pin threshold For falling VOUT 0.82VOUT 0.88VOUT 0.93VOUT V
VHYS(PG) PG pin hysteresis     0.02VOUT V
VIT+(PG) PG pin threshold For rising VOUT 0.84VOUT 0.90VOUT 0.95VOUT V
VOL(PG) PG pin low-level output voltage VOUT < VIT(PG), IPG = –1 mA
(current into device)		 0.4 V
Ilkg(PG) PG pin leakage current VOUT > VIT(PG), VPG = 6.5 V 1 µA
INR/SS NR/SS pin charging current VNR/SS = GND, VIN = 6.5 V 4.0 6.5 10 µA
IFB FB pin leakage current VIN = 6.5 V –100 100 nA
PSRR Power-supply ripple rejection VIN – VOUT = 0.4 V,
IOUT = 3 A, CNR/SS = 100 nF, CFF = 10 nF, COUT =
47 µF || 10 µF || 10 µF		 f = 10 kHz,
VOUT = 0.8 V,
VBIAS = 5.0 V		 42 dB
f = 500 kHz, VOUT = 0.8 V, VBIAS = 5.0 V 39
f = 10 kHz,
VOUT = 5.0 V		 40
f = 500 kHz, VOUT = 5.0 V 25
Vn Output noise voltage BW = 10 Hz to 100 kHz, VIN = 1.1 V,
VOUT = 0.8 V, VBIAS = 5.0 V, IOUT = 3 A,
CNR/SS = 100 nF, CFF = 10 nF,
COUT = 47 µF || 10 µF || 10 µF		 4.4 µVRMS
BW = 10 Hz to 100 kHz,
VOUT = 5.0 V, IOUT = 3 A, CNR/SS = 100 nF,
CFF = 10 nF, COUT = 47 µF || 10 µF || 10 µF		 7.7
TSD Thermal shutdown temperature Shutdown, temperature increasing 160 °C
Reset, temperature decreasing 140
(1) VOUT(nom) is the expected VOUT value set by the external feedback resistors.
(2) This 50-Ω load is disconnected when the test conditions specify an IOUT value.
(3) When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included.