SBVS446A August   2023  – January 2024 TPS7A53B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Voltage Regulation Features
        1. 6.3.1.1 DC Regulation
        2. 6.3.1.2 AC and Transient Response
      2. 6.3.2 System Start-Up Features
        1. 6.3.2.1 Programmable Soft-Start (NR/SS Pin)
        2. 6.3.2.2 Internal Sequencing
          1. 6.3.2.2.1 Enable (EN)
          2. 6.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 6.3.2.2.3 Active Discharge
        3. 6.3.2.3 Power-Good Output (PG)
      3. 6.3.3 Internal Protection Features
        1. 6.3.3.1 Foldback Current Limit (ICL)
        2. 6.3.3.2 Thermal Protection (Tsd)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Regulation
      2. 6.4.2 Disabled
      3. 6.4.3 Current Limit Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1  Recommended Capacitor Types
        1. 7.1.1.1 Input and Output Capacitor Requirements (CIN and COUT)
        2. 7.1.1.2 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
        3. 7.1.1.3 Feed-Forward Capacitor (CFF)
      2. 7.1.2  Soft-Start and Inrush Current
      3. 7.1.3  Optimizing Noise and PSRR
      4. 7.1.4  Charge Pump Noise
      5. 7.1.5  Current Sharing
      6. 7.1.6  Adjustable Operation
      7. 7.1.7  Power-Good Operation
      8. 7.1.8  Undervoltage Lockout (UVLO) Operation
      9. 7.1.9  Dropout Voltage (VDO)
      10. 7.1.10 Device Behavior During Transition From Dropout Into Regulation
      11. 7.1.11 Load Transient Response
      12. 7.1.12 Reverse Current Protection Considerations
      13. 7.1.13 Power Dissipation (PD)
      14. 7.1.14 Estimating Junction Temperature
      15. 7.1.15 TPS7A53EVM Thermal Analysis
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Board Layout
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.15 TPS7A53EVM Thermal Analysis

The RPS package is a 2.2mm × 2.5mm, 12-pin VQFN with 25µm plating on each via. The EVM is a 3 inch by 3 inch (7.62 mm × 7.62 mm) PCB comprised of four layers. Table 7-3 lists an overview of the EVM stackup. Figure 7-5 to Figure 7-9 provide layer details for the EVM.

Table 7-3 Stackup
LAYER NAME MATERIAL THICKNESS (mil)
1 Top overlay — —
2 Top solder Solder resist 0.40
3 Top layer Copper 1.40
4 Dielectric 1 FR-4, high TG 18.50
5 Mid layer 1 Copper 1.40
6 Dielectric 2 FR-4, high TG 18.60
7 Mid layer 2 Copper 1.40
8 Dielectric 3 FR-4, high TG 18.50
9 Bottom layer Copper 1.40
10 Bottom solder Solder resist 0.40
GUID-0E81A4AB-9796-4A92-A64E-F5DCCEBA7066-low.svgFigure 7-5 Top Composite View
GUID-799B7537-285A-4F00-B253-E6C9966084AB-low.svgFigure 7-7 Mid Layer 1 Routing
GUID-49C177B6-CEBC-412D-8F31-0FF6340B6B14-low.svgFigure 7-9 Bottom Layer Routing
GUID-D669CC91-F6BA-4354-A0F5-A6876DA1C7B4-low.svgFigure 7-6 Top Layer Routing
GUID-21A01E44-4D2C-429C-A83A-A217DA86C2BB-low.svgFigure 7-8 Mid Layer 2 Routing

Figure 7-10 shows the thermal gradient on the PCB that results when using a 1W power dissipation through the pass transistor with a 25°C ambient temperature.

GUID-26661039-966A-4FF8-9AD3-EBA58412386A-low.gifFigure 7-10 PCB Thermal Gradient

For additional information on the PCB, see the TPS7A53EVM-031 Evaluation Module user guide.