SBVS446A August   2023  – January 2024 TPS7A53B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Voltage Regulation Features
        1. 6.3.1.1 DC Regulation
        2. 6.3.1.2 AC and Transient Response
      2. 6.3.2 System Start-Up Features
        1. 6.3.2.1 Programmable Soft-Start (NR/SS Pin)
        2. 6.3.2.2 Internal Sequencing
          1. 6.3.2.2.1 Enable (EN)
          2. 6.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 6.3.2.2.3 Active Discharge
        3. 6.3.2.3 Power-Good Output (PG)
      3. 6.3.3 Internal Protection Features
        1. 6.3.3.1 Foldback Current Limit (ICL)
        2. 6.3.3.2 Thermal Protection (Tsd)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Regulation
      2. 6.4.2 Disabled
      3. 6.4.3 Current Limit Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1  Recommended Capacitor Types
        1. 7.1.1.1 Input and Output Capacitor Requirements (CIN and COUT)
        2. 7.1.1.2 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
        3. 7.1.1.3 Feed-Forward Capacitor (CFF)
      2. 7.1.2  Soft-Start and Inrush Current
      3. 7.1.3  Optimizing Noise and PSRR
      4. 7.1.4  Charge Pump Noise
      5. 7.1.5  Current Sharing
      6. 7.1.6  Adjustable Operation
      7. 7.1.7  Power-Good Operation
      8. 7.1.8  Undervoltage Lockout (UVLO) Operation
      9. 7.1.9  Dropout Voltage (VDO)
      10. 7.1.10 Device Behavior During Transition From Dropout Into Regulation
      11. 7.1.11 Load Transient Response
      12. 7.1.12 Reverse Current Protection Considerations
      13. 7.1.13 Power Dissipation (PD)
      14. 7.1.14 Estimating Junction Temperature
      15. 7.1.15 TPS7A53EVM Thermal Analysis
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Board Layout
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) RPS (VQFN) UNIT
12 PINS
JEDEC(2) EVM(3)
RθJA Junction-to-ambient thermal resistance 68.7 46.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.8 43.8 °C/W
RθJB Junction-to-board thermal resistance 19.3 N/A °C/W
ΨJT Junction-to-top characterization parameter 1.3 4.5 °C/W
ΨJB Junction-to-board characterization parameter 18.9 22 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2 11.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) JEDEC standard. (2s2p, no vias to internal plane and bottom layer).
(3) EVM thermal model using the TPS7A53EVM-031 for thermal analysis, see the  TPS7A53EVM Thermal Analysis section for more information.