SBVS395 July   2022 TPS7A57

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Setting and Regulation
      2. 7.3.2 Low-Noise, Ultra-High Power-Supply Rejection Ratio (PSRR)
      3. 7.3.3 Programmable Soft-Start (NR/SS Pin)
      4. 7.3.4 Precision Enable and UVLO
      5. 7.3.5 Charge Pump Enable and BIAS Rail
      6. 7.3.6 Power-Good Pin (PG Pin)
      7. 7.3.7 Active Discharge
      8. 7.3.8 Thermal Shutdown Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
      4. 7.4.4 Current-Limit Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Precision Enable (External UVLO)
      2. 8.1.2  Undervoltage Lockout (UVLO) Operation
        1. 8.1.2.1 IN Pin UVLO
        2. 8.1.2.2 BIAS UVLO
        3. 8.1.2.3 Typical UVLO Operation
        4. 8.1.2.4 UVLO(IN) and UVLO(BIAS) Interaction
      3. 8.1.3  Dropout Voltage (VDO)
      4. 8.1.4  Input and Output Capacitor Requirements (CIN and COUT)
      5. 8.1.5  Recommended Capacitor Types
      6. 8.1.6  Soft-Start, Noise Reduction (NR/SS Pin), and Power-Good (PG Pin)
      7. 8.1.7  Optimizing Noise and PSRR
      8. 8.1.8  Adjustable Operation
      9. 8.1.9  Load Transient Response
      10. 8.1.10 Current Limit and Foldback Behavior
      11. 8.1.11 Charge Pump Operation
      12. 8.1.12 Sequencing
      13. 8.1.13 Power-Good Functionality
      14. 8.1.14 Output Impedance
      15. 8.1.15 Paralleling for Higher Output Current and Lower Noise
      16. 8.1.16 Current Mode Margining
      17. 8.1.17 Voltage Mode Margining
      18. 8.1.18 Power Dissipation (PD)
      19. 8.1.19 Estimating Junction Temperature
      20. 8.1.20 TPS7A57EVM-081 Thermal Analysis
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) TPS7A57 UNIT
RTE (WQFN) (2) RTE (WQFN) (3)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 40.3 21.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 39.3 – °C/W
RθJB Junction-to-board thermal resistance 14 – °C/W
ψJT Junction-to-top characterization parameter 0.5 0.4 °C/W
ψJB Junction-to-board characterization parameter 14.0 11.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.8 – °C/W
(1) For more information about traditional and new thermal metrics, see the Using New Thermal Metric application report.
(2) Evaluated using JEDEC standard (2s2p).
(3) Evaluated using EVM.