SLVSAB1G June   2011  – March 2020 TPS7A63-Q1 , TPS7A6401-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Fixed Output Voltage Option
      2.      Adjustable Output Voltage Option
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Power Up, Reset Delay, and Reset Output
      2. 7.3.2  Adjustable Output Voltage
      3. 7.3.3  Chip Enable
      4. 7.3.4  Charge Pump Operation
      5. 7.3.5  Low-Power Mode
      6. 7.3.6  Undervoltage Shutdown
      7. 7.3.7  Low-Voltage Tracking
      8. 7.3.8  Integrated Fault Protection
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Integrated Window Watchdog
        1. 7.3.10.1 Programmable-Window Watchdog
        2. 7.3.10.2 Watchdog Enable
        3. 7.3.10.3 Watchdog Service Signal
        4. 7.3.10.4 Watchdog Fault Outputs
        5. 7.3.10.5 Watchdog Initialization
        6. 7.3.10.6 Watchdog Operation
        7. 7.3.10.7 Watchdog Fault Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN Lower Than 4 V
      2. 7.4.2 Operation With VIN Larger Than 4 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Example
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Using the TPS7A6333-Q1 or TPS7A6350-Q1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Using the TPS7A6401-Q1
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation and Thermal Considerations
        1. 10.1.1.1 Example
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.1 Power Dissipation and Thermal Considerations

Calculated the power dissipated in the device using Equation 8.

Equation 8. PD = IOUT × (VIN – VOUT)) + IQUIESCENT × VIN

where

  • PD = continuous power dissipation
  • IOUT = output current
  • VIN = input voltage
  • VOUT = output voltage
  • IQUIESCENT = quiescent current

As IQUIESCENT << IOUT, therefore, ignore the term IQUIESCENT × VIN in Equation 8.

For a device in operation at a given ambient air temperature (TA), calculate the junction temperature (TJ) using Equation 9.

Equation 9. TJ = TA + (RθJA × PD)

where

  • RθJA = junction-to-ambient-air thermal impedance

Calculate the rise in junction temperature due to power dissipation using Equation 10.

Equation 10. ΔT = TJ – TA = (RθJA × PD)

For a given maximum junction temperature (TJ-Max), calculate the maximum ambient air temperature (TA-Max) at which the device can operate using Equation 11.

Equation 11. TA-Max = TJ-Max – (RθJA × PD)