SLVSBL0F December   2012  – December 2017 TPS7A66-Q1 , TPS7A69-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Hardware-Enable Option
      2.      Input-Voltage-Sensing Option
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 Power-On Reset (PG)
      4. 7.3.4 Reset Delay Timer (CT)
      5. 7.3.5 Sense Comparator (SI and SO for TPS7A69-Q1)
      6. 7.3.6 Adjustable Output Voltage (FB for TPS7A6601-Q1)
      7. 7.3.7 Undervoltage Shutdown
      8. 7.3.8 Low-Voltage Tracking
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Regulation
      2. 7.4.2 Disabled
      3. 7.4.3 Operation With V(VinUVLO)< VIN < VIN(min)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A66-Q1 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input Capacitor
          2. 8.2.1.2.2 Output Capacitor
        3. 8.2.1.3 Application Curve
      2. 8.2.2 TPS7A69-Q1 Typical Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Low-Voltage Tracking Threshold
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Mounting
      2. 10.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following:
    • Device Temperature Grade 1
    • Device Temperature Grade 0 (TPS7A6650EDGNRQ1 Only)
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C4
  • Device Junction Temperature Range:
    –40°C to +150°C
  • 4-V to 40-V Wide Vin Input Voltage Range With up to 45-V Transient
  • Output Current: 150 mA
  • Low Quiescent Current, I(q):
    • 2 µA When EN = Low (Shutdown Mode)
    • 12 µA Typical at Light Loads
  • Low ESR Ceramic Output Stability Capacitor (2.2 µF–100 µF)
  • 300-mV Dropout Voltage at 150 mA
    (Typical, V(Vin) = 4 V)
  • Fixed (3.3-V and 5-V) and Adjustable
    (1.5-V to 5-V) Output Voltages
    (Adjustable for TPS7A66-Q1 Only)
  • Low Input Voltage Tracking
  • Integrated Power-On Reset:
    • Programmable Reset-Pulse Delay
    • Open-Drain Reset Output
  • Integrated Fault Protection:
    • Thermal Shutdown
    • Short-Circuit Protection
  • Input Voltage Sense Comparator
    (TPS7A69-Q1 Only)
  • Packages:
    • 8-Pin SOIC-D for TPS7A69-Q1
    • 8-Pin HVSSOP-DGN for TPS7A6601-Q1