SBVS134F January   2012  – April 2017 TPS7A7001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Internal Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Capacitor (IN)
      2. 8.1.2 Output Capacitor (OUT)
      3. 8.1.3 Feedback Resistors (FB)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendation to Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Thermal Protection
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage IN –0.3 7 V
EN, FB, OUT –0.3 VIN + 0.3(2)
Current OUT Internally limited A
Temperature Operating virtual junction, TJ –55 150 °C
Storage, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The absolute maximum rating is VIN + 0.3 V or 7.0 V, whichever is smaller.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage 1.425 6.5 V
VEN Enable pin voltage 0 VIN V
CIN Input capacitor 1 10 µF
COUT Output capacitor(1)(2) 4.7 10 200 µF
CFB Feedforward capacitance 0 100 nF
IOUT Output current 0 2 A
TJ Junction temperature –40 125 °C
(1) See Figure 1 and Figure 2 for additional output capacitor ESR requirements.
(2) For output capacitors larger than 47 µF, a feedforward capacitor of at least 220 pF must be used.

6.4 Thermal Information

THERMAL METRIC(1) TPS7A7001 UNIT
DDA
(SO PowerPAD)
8 PINS
RθJA Junction-to-ambient thermal resistance 46.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.2 °C/W
RθJB Junction-to-board thermal resistance 29.9 °C/W
ψJT Junction-to-top characterization parameter 10.2 °C/W
ψJB Junction-to-board characterization parameter 29.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Over the full operating temperature range (see Recommended Operating Conditions), VEN = 1.1 V, VFB = VOUT(1), 1.425 V ≤ VIN ≤ 6.5 V, 10 µA ≤ IOUT ≤ 2 A, COUT = 10 μF (unless otherwise noted). Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT VOLTAGE
IGND GND pin current (small) VIN = 3.3 V,
50-Ω load resistor between OUT and GND		 3 mA
GND pin current (shutdown) VIN = 6.5 V, VEN = 0 V 5 μA
OUTPUT VOLTAGE
VOUT Output voltage accuracy(2)(3) VIN = VOUT + 0.5 V(4), IOUT = 10 mA –2% 2%
VIN = 1.8 V, IOUT = 0.8 A, 0°C ≤ TJ = TA ≤ +85°C –2% 2%
IOUT = 10 mA –3% 3%
ΔVO(ΔVI) Line regulation IOUT = 10 mA 0.2 0.4 %/V
ΔVO(ΔIO) Load regulation(3) 10 mA ≤ IOUT ≤ 2 A 0.25 0.75 %/A
VDO Dropout voltage (5) IOUT = 1.0 A, 0.5 V ≤ VOUT ≤ 5.0 V 200 mV
IOUT = 1.5 A, 0.5 V ≤ VOUT ≤ 5.0 V 300
IOUT = 2.0 A, 0.5 V ≤ VOUT ≤ 5.0 V 380
ILIM Output current limit VIN = 1.425 V, VOUT = 0.9 × VOUT(NOM) 2.1 A
FEEDBACK
VREF Reference voltage accuracy VIN = 3.3 V, VFB = VOUT, IOUT = 10 mA 0.490 0.500 0.510 V
IFB FB pin current VFB = 0.5 V 1 μA
ENABLE
IEN EN pin current VEN = 0 V, VIN = 3.3 V 0.2 μA
VILEN EN pin input low (disable) VIN = 3.3 V 0 0.5 V
VIHEN EN pin input high (enable) VIN = 3.3 V 1.1 VIN V
TEMPERATURE
TSD Thermal shutdown temperature Shutdown, temperature increasing 160 °C
Reset, temperature decreasing 140 °C
(1) When setting VOUT to a value other than 0.5 V, connect R2 to the FB pin using 27-kΩ ≤ R2 ≤ 33-kΩ resistors. See Functional Block Diagram for details of R1 and R2.
(2) Accuracy does not include error on feedback resistors R1 and R2.
(3) TPS7A7001 is not tested at VOUT = 0.5 V, 2.3 V ≤ VIN ≤ 6.5 V, and 500 mA ≤ IOUT ≤ 2 A because the power dissipation is higher than the maximum rating of the package. Also, this accuracy specification does not apply to any application condition that exceeds the power dissipation limit of the package.
(4) VIN = VOUT + 0.5 V or 1.425 V, whichever is greater.
(5) VDO = VIN – VOUT with VFB = GND configuration.

6.6 Typical Characteristics

for all fixed voltage versions and an adjustable version at TJ = 25°C, VEN = VIN, CIN = 10 μF, COUT = 10 μF, and using the component values in Table 2 (unless otherwise noted)
TPS7A7001 g000_bvs134.gif
COUT = 10 µF
Figure 1. Stability Curve
TPS7A7001 g003_bvs134.png
VOUT = 3.3 V
Figure 3. Dropout Voltage vs Output Current
TPS7A7001 g005_bvs134.png
VOUT = 1.4 V
Figure 5. Dropout Voltage vs Output Current
TPS7A7001 g001_bvs134.gif
COUT = 100 µF
Figure 2. Stability Curve
TPS7A7001 g004_bvs134.png
VOUT = 1.6 V
Figure 4. Dropout Voltage vs Output Current