SBVS304B June   2017  – October 2021 TPS7A83A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: General
    6. 7.6 Electrical Characteristics: TPS7A8300A
    7. 7.7 Electrical Characteristics: TPS7A8301A
    8. 7.8 Typical Characteristics: TPS7A8300A
    9. 7.9 Typical Characteristics: TPS7A8301A
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Voltage Regulation Features
        1. 8.3.1.1 DC Regulation
        2. 8.3.1.2 AC and Transient Response
      2. 8.3.2 System Start-Up Features
        1. 8.3.2.1 Programmable Soft-Start (NR/SS)
        2. 8.3.2.2 Internal Sequencing
          1. 8.3.2.2.1 Enable (EN)
          2. 8.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 8.3.2.2.3 Active Discharge
        3. 8.3.2.3 Power-Good Output (PG)
      3. 8.3.3 Internal Protection Features
        1. 8.3.3.1 Foldback Current Limit (ICL)
        2. 8.3.3.2 Thermal Protection (Tsd)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Regulation
      2. 8.4.2 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 External Component Selection
        1. 9.1.1.1 Adjustable Operation
        2. 9.1.1.2 ANY-OUT Programmable Output Voltage
        3. 9.1.1.3 ANY-OUT Operation
        4. 9.1.1.4 Increasing ANY-OUT Resolution for LILO Conditions
        5. 9.1.1.5 Recommended Capacitor Types
        6. 9.1.1.6 Input and Output Capacitor Requirements (CIN and COUT)
        7. 9.1.1.7 Feed-Forward Capacitor (CFF)
        8. 9.1.1.8 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
      2. 9.1.2 Start Up
        1. 9.1.2.1 Soft-Start (NR/SS)
          1. 9.1.2.1.1 Inrush Current
        2. 9.1.2.2 Undervoltage Lockout (UVLO)
        3. 9.1.2.3 Power-Good (PG) Function
      3. 9.1.3 AC and Transient Performance
        1. 9.1.3.1 Power-Supply Rejection Ratio (PSRR)
        2. 9.1.3.2 Output Voltage Noise
        3. 9.1.3.3 Optimizing Noise and PSRR
          1. 9.1.3.3.1 Charge Pump Noise
        4. 9.1.3.4 Load Transient Response
      4. 9.1.4 DC Performance
        1. 9.1.4.1 Output Voltage Accuracy (VOUT)
        2. 9.1.4.2 Dropout Voltage (VDO)
          1. 9.1.4.2.1 Behavior When Transitioning From Dropout Into Regulation
      5. 9.1.5 Sequencing Requirements
      6. 9.1.6 Negatively Biased Output
      7. 9.1.7 Reverse Current
      8. 9.1.8 Power Dissipation (PD)
        1. 9.1.8.1 Estimating Junction Temperature
        2. 9.1.8.2 Recommended Area for Continuous Operation (RACO)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Evaluation Models
        2. 12.1.1.2 Spice Models
      2. 12.1.2 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

For best overall performance, place all circuit components on the same side of the circuit board and as near as practical to the respective LDO pin connections. Place ground return connections to the input and output capacitor, and to the LDO ground pin as close as possible to each other, connected by a wide, component-side, copper surface. The use of vias and long traces to the input and output capacitors is strongly discouraged and negatively affects system performance. The grounding and layout scheme shown in Figure 11-1 minimizes inductive parasitics, and thereby reduces load-current transients, minimizes noise, and increases circuit stability.

Using a ground reference plane either embedded in the PCB itself or located on the bottom side of the PCB opposite the components is beneficial to the layout. This reference plane serves to assure accuracy of the output voltage, shield noise, and behaves similarly to a thermal plane to spread (or sink) heat from the LDO device when connected to the thermal pad. In most applications, this ground plane is necessary to meet thermal requirements.