SBVS233B January   2016  – June 2021 TPS7A84

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Low-Noise, High-PSRR Output
      2. 7.3.2  Integrated Resistance Network (ANY-OUT)
      3. 7.3.3  Bias Rail
      4. 7.3.4  Power-Good Function
      5. 7.3.5  Programmable Soft-Start
      6. 7.3.6  Internal Current Limit (ILIM)
      7. 7.3.7  Enable
      8. 7.3.8  Active Discharge Circuit
      9. 7.3.9  Undervoltage Lockout (UVLO)
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with 1.1 V ≤ VIN < 1.4 V
      2. 7.4.2 Operation with 1.4 V ≤ VIN ≤ 6.5 V
      3. 7.4.3 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Recommended Capacitor Types
      2. 8.1.2  Input and Output Capacitor Requirements (CIN and COUT)
      3. 8.1.3  Noise-Reduction and Soft-Start Capacitor (CNR/SS)
      4. 8.1.4  Feed-Forward Capacitor (CFF)
      5. 8.1.5  Soft-Start and In-Rush Current
      6. 8.1.6  Optimizing Noise and PSRR
      7. 8.1.7  Charge Pump Noise
      8. 8.1.8  ANY-OUT Programmable Output Voltage
      9. 8.1.9  ANY-OUT Operation
      10. 8.1.10 Increasing ANY-OUT Resolution for LILO Conditions
      11. 8.1.11 Current Sharing
      12. 8.1.12 Adjustable Operation
      13. 8.1.13 Sequencing Requirements
        1. 8.1.13.1 Sequencing with a Power-Good DC-DC Converter Pin
        2. 8.1.13.2 Sequencing with a Microcontroller (MCU)
      14. 8.1.14 Power-Good Operation
      15. 8.1.15 Undervoltage Lockout (UVLO) Operation
      16. 8.1.16 Dropout Voltage (VDO)
      17. 8.1.17 Behavior when Transitioning from Dropout into Regulation
      18. 8.1.18 Load Transient Response
      19. 8.1.19 Negatively-Biased Output
      20. 8.1.20 Reverse Current Protection
      21. 8.1.21 Power Dissipation (PD)
      22. 8.1.22 Estimating Junction Temperature
      23. 8.1.23 Recommended Area for Continuous Operation (RACO)
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Input, Low-Output (LILO) Voltage Conditions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application for a 5.0-V Rail
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configurations and Functions

GUID-B05AC1CF-9DA0-43EE-A8B9-ADD9C503BD9D-low.gifFigure 5-1 RGR Package,3.5-mm × 3.5-mm, 20-Pin VQFN,Top View
Table 5-1 Pin Functions
PIN DESCRIPTION
NAME NO. I/O
50mV 5 I ANY-OUT voltage setting pins. Connect these pins to ground, SNS, or leave floating. Connecting these pins to ground increases the output voltage, whereas connecting these pins to SNS increases the resolution of the ANY-OUT network but decreases the range of the network; multiple pins can be simultaneously connected to GND or SNS to select the desired output voltage. Leave these pins floating (open) when not in use. See the Section 8.1.8 section for additional details.
100mV 6
200mV 7
400mV 9
800mV 10
1.6V 11
BIAS 12 I BIAS supply voltage. This pin enables the use of low-input voltage, low-output (LILO) voltage conditions (that is, VIN = 1.2 V, VOUT = 1 V) to reduce power dissipation across the die. The use of a BIAS voltage improves dc and ac performance for VIN ≤ 2.2 V. A 10-µF capacitor or larger must be connected between this pin and ground. If not used, this pin must be left floating or tied to ground.
EN 14 I Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN. If enable functionality is required, VEN must always be high after VIN is established when a BIAS supply is used. See the Section 8.1.13 section for more details.
FB 3 I Feedback pin connected to the error amplifier. Although not required, a 10-nF feed-forward capacitor from FB to OUT (as close to the device as possible) is recommended to maximize ac performance. The use of a feed-forward capacitor can disrupt PG (power good) functionality. See the Section 8.1.8 and Section 8.1.12 sections for more details.
GND 8, 18 — Ground pin. These pins must be connected to ground, the thermal pad, and each other with a low-impedance connection.
IN 15-17 I Input supply voltage pin. A 47-μF or larger ceramic capacitor (25 μF or greater of capacitance) from IN to ground is recommended to reduce the impedance of the input supply. Place the input capacitor as close to the input as possible. See the Section 8.1.2 section for more details.
NR/SS 13 — Noise-reduction and soft-start pin. Connecting an external capacitor between this pin and ground reduces reference voltage noise and also enables the soft-start function. Although not required, a 10-nF or larger capacitor is recommended to be connected from NR/SS to GND (as close to the pin as possible) to maximize ac performance. See the Section 8.1.3 section for more details.
OUT 1, 19, 20 O Regulated output pin. A 47-μF or larger ceramic capacitor (25 μF or greater of capacitance) from OUT to ground is required for stability and must be placed as close to the output as possible. Minimize the impedance from the OUT pin to the load. See the Section 8.1.2 section for more details.
PG 4 O Active-high, power-good pin. An open-drain output indicates when the output voltage reaches 89.3% of the target. The use of a feed-forward capacitor can disrupt PG (power good) functionality. See the Section 7.3.4 section for more details.
SNS 2 I Output voltage sense input pin. This pin connects the internal R1 resistor to the output. Connect this pin to the load side of the output trace only if the ANY-OUT feature is used. If the ANY-OUT feature is not used, leave this pin floating. See the Section 8.1.8 and Section 8.1.12 sections for more details.
Thermal pad — Connect the thermal pad to a large-area ground plane. The thermal pad is internally connected to GND.