SBVS281A March   2016  – July 2016 TPS7A87

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Regulation Features
        1. 7.3.1.1 DC Regulation
        2. 7.3.1.2 AC and Transient Response
      2. 7.3.2 System Start-Up Features
        1. 7.3.2.1 Programmable Soft-Start (NR/SSx)
        2. 7.3.2.2 Sequencing
          1. 7.3.2.2.1 Enable (ENx)
          2. 7.3.2.2.2 Undervoltage Lockout (UVLOx) Control
          3. 7.3.2.2.3 Active Discharge
        3. 7.3.2.3 Power-Good Output (PGx)
      3. 7.3.3 Internal Protection Features
        1. 7.3.3.1 Foldback Current Limit (ICLx)
        2. 7.3.3.2 Thermal Protection (Tsdx)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Regulation
      2. 7.4.2 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Component Selection
        1. 8.1.1.1 Setting the Output Voltage (Adjustable Operation)
        2. 8.1.1.2 Capacitor Recommendations
        3. 8.1.1.3 Input and Output Capacitor (CINx and COUTx)
        4. 8.1.1.4 Feed-Forward Capacitor (CFFx)
        5. 8.1.1.5 Noise-Reduction and Soft-Start Capacitor (CNR/SSx)
      2. 8.1.2 Start-Up
        1. 8.1.2.1 Circuit Soft-Start Control (NR/SSx)
          1. 8.1.2.1.1 In-Rush Current
        2. 8.1.2.2 Undervoltage Lockout (UVLOx) Control
        3. 8.1.2.3 Power-Good (PGx) Function
      3. 8.1.3 AC and Transient Performance
        1. 8.1.3.1 Power-Supply Rejection Ratio (PSRR)
        2. 8.1.3.2 Channel-to-Channel Output Isolation and Crosstalk
        3. 8.1.3.3 Output Voltage Noise
        4. 8.1.3.4 Optimizing Noise and PSRR
          1. 8.1.3.4.1 Charge Pump Noise
        5. 8.1.3.5 Load Transient Response
      4. 8.1.4 DC Performance
        1. 8.1.4.1 Output Voltage Accuracy (VOUTx)
        2. 8.1.4.2 Dropout Voltage (VDO)
          1. 8.1.4.2.1 Behavior when Transitioning from Dropout into Regulation
      5. 8.1.5 Reverse Current Protection
      6. 8.1.6 Power Dissipation (PD)
        1. 8.1.6.1 Estimating Junction Temperature
        2. 8.1.6.2 Recommended Area for Continuous Operation (RACO)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 SPICE Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RTJ|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 Evaluation Modules

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS7A87. The summary information for this fixture is shown in Table 11.

Table 11. Design Kits & Evaluation Modules(1)

NAME PART NUMBER
TPS7A88 evaluation module TPS7A88EVM User's Guide
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the device product folder at www.ti.com.

The EVM can be requested at the Texas Instruments web site (www.ti.com) through the TPS7A87 product folder.

11.1.1.2 SPICE Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS7A87 is available through the TPS7A87 product folder under simulation models.

11.1.2 Device Nomenclature

Table 12. Ordering Information(1)

PRODUCT DESCRIPTION
TPS7A87XXYYYZ XX represents the output voltage. 01 is the adjustable output version.
YYY is the package designator.
Z is the package quantity.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.