SBVS248A November   2015  – November 2015 TPS7A88

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Independent Dual-Channel LDO
      2. 7.3.2 Output Enable
      3. 7.3.3 Dropout Voltage (VDO)
      4. 7.3.4 Output Voltage Accuracy
      5. 7.3.5 Low Output Noise
      6. 7.3.6 Internal Protection Circuitry
        1. 7.3.6.1 Undervoltage Lockout (UVLO)
        2. 7.3.6.2 Internal Current Limit (ICL)
        3. 7.3.6.3 Thermal Protection
      7. 7.3.7 Output Soft-Start Control
      8. 7.3.8 Power-Good Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Outputs
      2. 8.1.2 Start-Up
        1. 8.1.2.1 Enable (ENx) and Undervoltage Lockout (UVLO)
        2. 8.1.2.2 Noise-Reduction and Soft-Start Capacitor (CNR/SSx)
        3. 8.1.2.3 Soft-Start and Inrush Current
      3. 8.1.3 Capacitor Recommendation
        1. 8.1.3.1 Input and Output Capacitor Requirements (CINx and COUTx)
        2. 8.1.3.2 Feed-Forward Capacitor (CFFx)
      4. 8.1.4 AC Performance
        1. 8.1.4.1 Power-Supply Ripple Rejection (PSRR)
        2. 8.1.4.2 Channel-to-Channel Output Isolation and Crosstalk
        3. 8.1.4.3 Load-Step Transient Response
        4. 8.1.4.4 Noise
      5. 8.1.5 Power Dissipation (PD)
      6. 8.1.6 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (November 2015) to A Revision

  • Released to production Go