SBVS392A June 2022 – August 2023 TPS7B4255-Q1
PRODUCTION DATA
Solder-pad footprint recommendations for the TPS7B4255-Q1 are available at the end of this document and at www.ti.com.
TI's DYB package footprint can be used for both the DYB package as well as the DBV package for easy multisourcing.