SBVS441 December   2022 TPS7B4255

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6.     Timing Characteristics
    7. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Regulated Output (VOUT)
      2. 7.3.2 Undervoltage Lockout
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Current Limit
      5. 7.3.5 VOUT Short to Battery
      6. 7.3.6 Tracking Regulator With an Enable Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 3 V
      2. 7.4.2 Operation With ADJ/EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Dropout Voltage
      2. 8.1.2 Reverse Current
      3. 8.1.3 Signal-Buffering LDO
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Package Mounting
        2. 8.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
        3. 8.4.1.3 Power Dissipation and Thermal Considerations
        4. 8.4.1.4 Thermal Performance Versus Copper Area
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

specified at TJ = –40°C to +150°C, VIN = 13.5 V,  IOUT = 100 µA, COUT = 1 µF, 1 mΩ < COUT ESR < 2 Ω,  CIN = 1 µF, and VADJ = 5 V (unless otherwise noted), typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ΔVOUT Output voltage tracking accuracy VIN = VOUT + 600 mV to 40 V, IOUT = 100 µA to 70 mA –5 5 mV
ΔVOUT(ΔVIN) Line regulation VIN = VOUT + 600 mV to 40 V 0.5 mV
ΔVOUT(ΔIOUT) Load regulation VIN = VOUT + 600 mV, IOUT = 100 µA to 70 mA (1) 0.5 mV
IQ Quiescent current VIN = 5.6 V to 40 V, IOUT = 100 µA, TJ = 25ºC 34 40 µA
VIN = 5.6 V to 40 V, IOUT = 100 µA, -40ºC < TJ < 85ºC 45
VIN = 5.6 V to 40 V, IOUT = 100 µA 50
IGND Ground current VIN = 5.6 V to 40 V, IOUT = 70 mA, TJ = 25ºC 470
VIN = 5.6 V to 40 V, IOUT = 70 mA 550
VDO Dropout voltage IOUT = 70 mA, VADJ ≥ 3.3 V, VIN = VADJ 470 mV
IOUT = 50 mA, VADJ ≥ 4 V, VIN = VADJ 330
ISHUTDOWN Shutdown supply current (IGND) VADJ/EN = 0 V 3 µA
IADJ/EN ADJ/EN pin current 0.25
VUVLO(RISING) Rising input supply UVLO VIN rising 2.6 2.7 2.81 V
VUVLO(FALLING) Falling input supply UVLO VIN falling 2.3 2.4 2.5
VUVLO(HYST) VUVLO(IN) hysteresis 300 mV
VIL Adjustable and enable logic input low level 1 V
VIH Adjustable and enable logic input high level 1.65
ICL Output current limit VIN = VOUT + 1 V, VOUT short to 90% x VADJ 75 100 130 mA
PSRR Power-supply ripple rejection VIN - VOUT = 1 V, Frequency = 100 Hz, IOUT = 70 mA 80 dB
Vn Output noise voltage VOUT = 3.3 V, IOUT = 1 mA, a 5 µVRMS reference is used for this measurement 150 µVRMS
IR Reverse current at VIN VIN = 0 V, VOUT = 20 V, VADJ = 5 V -0.25 0.25 µA
IRN1 Reverse current at negative VIN VIN = -20 V, VOUT = 20 V, VADJ = 5 V -0.5 0.5
IRN2 Reverse current at negative VIN VIN = -20 V, VOUT = 0 V, VADJ = 5 V -0.5 0.5
TJ Junction temperature –40 150 °C
TSD(SHUTDOWN) Junction shutdown temperature 175 °C
TSD(HYST) Hysteresis of thermal shutdown 15 °C
(1) Power dissipation is limited to 2 W for device production testing purposes. The power dissipation can be higher during normal operation. Please see the thermal dissipation section for more information on how much power the device can dissipate while maintaining a junction temperature below 150℃.