SLVSCE8C January   2015  – September 2018 TPS7B7701-Q1 , TPS7B7702-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fault Detection and Protection
      2. 7.3.2  Short-Circuit and Overcurrent Protection
      3. 7.3.3  Short-to-Battery and Reverse Current Detection
      4. 7.3.4  Thermal Shutdown
      5. 7.3.5  Integrated Reverse-Polarity Protection
      6. 7.3.6  Integrated Inductive Clamp
      7. 7.3.7  Undervoltage Lockout
      8. 7.3.8  Enable (EN, EN1, and EN2)
      9. 7.3.9  Internal Voltage Regulator (VCC)
      10. 7.3.10 Current Sense Multiplexing
      11. 7.3.11 Adjustable Output Voltage (FB, FB1, and FB2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With IN < 4.5 V
      2. 7.4.2 Operation With EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
        3. 8.2.2.3 Current Sense Resistor Selection
        4. 8.2.2.4 Current-Limit Resistor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

For the layout of TPS7B770x-Q1 device, place the input and output capacitors close to the device as shown in Figure 25. To enhance the thermal performance, TI recommends surrounding the device with some vias.

Minimize equivalent-series inductance (ESL) and ESR to maximize performance and provide stability. Place every capacitor as close as possible to the device and on the same side of the PCB as the regulator.

Do not place any of the capacitors on the opposite side of the PCB from where the regulator is installed. TI strongly discourages the use long traces because they can negatively impact system performance and cause instability.

If possible, and to maintain the maximum performance specified in this device data sheet, use the same layout pattern used for the TPS7B770x-Q1 evaluation board, available online at www.ti.com/tool/TPS7B7702EVM.