SBVS361A April   2020  – November 2020 TPS7B84-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Undervoltage Lockout
      3. 7.3.3 Thermal Shutdown
      4. 7.3.4 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Adjustable Device Feedback Resistor Selection
      3. 8.1.3 Feed-Forward Capacitor (CFF)
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
        1. 8.1.6.1 Thermal Performance Versus Copper Area
        2. 8.1.6.2 Power Dissipation vs Ambient Temperature
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Mounting
      2. 10.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCY|4
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-66AB5E39-6C83-4514-80C4-8FD6CB40AAD6-low.svgFigure 5-1 DCY Package,4-Pin SOT-223,Top View
GUID-D09DA0F5-19B2-4FD9-8483-D3F5A71E658C-low.svgFigure 5-2 DRB Package,8-Pin VSON,Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME DCY DRB
EN 2 7 I Enable pin. The device is disabled when the enable pin becomes lower than the enable logic input low level (VIL). To ensure the device is enabled, the EN pin must be driven above the logic high level (VIH). This pin should not be left floating as this pin is high impedance if it is left floating the part may enable or disable.
GND 4 5 G Ground pin. Connect this pin to the thermal pad with a low-impedance connection.
FB/NC — 2 I Feedback pin when using an external resistor divider or an NC pin when using the device with a fixed output voltage. When using the adjustable device this pin must be connected through a resistor divider to the output for the device to function.
NC __ 3, 4, 6 __ No internal connection. Connect these pins to GND for the best thermal performance.
IN 1 8 I Input power-supply voltage pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground as listed in the Recommended Operating Conditions table and the Section 8.2.2.1 section. Place the input capacitor as close to the input of the device as possible.
OUT 3 1 O Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Section 8.2.2.2 section. Place the output capacitor as close to output of the device as possible. If using a high ESR capacitor, decouple the output with a 100-nF ceramic capacitor.
Thermal pad — Pad — Thermal pad. Connect the pad to GND for the best possible thermal performance. See the Section 10 section for more information.
(1) I = input; O = output; G = ground.