SBVS362C June   2020  – August 2022 TPS7B86-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Power-Good (PG)
      3. 7.3.3 Adjustable Power-Good Delay Timer (DELAY)
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Adjustable Device Feedback Resistor Selection
      3. 8.1.3 Feed-Forward Capacitor
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
        1. 8.1.6.1 Thermal Performance Versus Copper Area
        2. 8.1.6.2 Power Dissipation Versus Ambient Temperature
      7. 8.1.7 Estimating Junction Temperature
      8. 8.1.8 Power-Good
        1. 8.1.8.1 Setting the Adjustable Power-Good Delay
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor
        2. 8.2.2.2 Output Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Package Mounting
        2. 8.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 8.4.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
  • KVU|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
VIN Input voltage 3 40 V
VOUT Output voltage 1.2 18 V
IOUT Output current 0 500 mA
FEN Enable pin frequency(1) 5 kHz
VEN Enable Pin voltage 0 40 V
VDelay Delay pin voltage, power-good adjustable threshold 0 5.5 V
VPG Power-good output pin 0 18 V
CFF Feed-forward capacitor  0 1 µF
COUT Output capacitor(3) 2.2 220 µF
ESR Output capacitor ESR requirements 0.001 2 Ω
CIN Input capacitor(2) 0.1 1 µF
CDelay Power-good delay capacitor 1 µF
TJ Operating junction temperature –40 150 °C
(1) Minimum pulse time on the EN pin is 100 µs.
(2) For robust EMI performance the minimum input capacitance is 500 nF.
(3) Effective output capacitance of 1 µF minimum required for stability.