SLVSDO0F September   2018  – March 2024 TPS7H2201-SEP , TPS7H2201-SP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: All Devices
    6. 6.6  Electrical Characteristics: CFP and KGD Options
    7. 6.7  Electrical Characteristics: HTSSOP Option
    8. 6.8  Switching Characteristics (All Devices)
    9. 6.9  Quality Conformance Inspection
    10. 6.10 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable, Undervoltage, and Overvoltage Protection
      2. 8.3.2 Adjustable Rise Time
      3. 8.3.3 Programmable Current Limiting
      4. 8.3.4 Programmable Fault Timer
      5. 8.3.5 Current Sense
      6. 8.3.6 Parallel Operation
      7. 8.3.7 Reverse Current Protection
      8. 8.3.8 Forward Leakage Current
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Redundancy
      2. 9.2.2 Protection
      3. 9.2.3 Design Requirements
      4. 9.2.4 Detailed Design Procedure
        1. 9.2.4.1 Undervoltage Lockout
        2. 9.2.4.2 Overvoltage Protection
        3. 9.2.4.3 Current Limit
        4. 9.2.4.4 Programmable Fault Timers
        5. 9.2.4.5 Soft Start Time
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Adjustable Rise Time

An external capacitor, CSS, connected between the VOUT and SS pins sets the slew rate. The desired slew rate VOUTSR is determined by tr, the rise time in seconds, and ΔV, the change in VOUT voltage in Volts as shown in Equation 3.

Equation 3. GUID-F5B70CF8-A4E5-414E-821C-924AFDD3974E-low.gif

In order to avoid false trips due to the programmable current limit, the desired slew rate must be less than VOUTSR,MAX as shown in Equation 4, where IL is the programmed current limit, IVOUT is the normal operation current flowing through the switch, and COUT is the output capacitor.

Equation 4. GUID-6EEF74A1-49B0-465C-B89E-B3F74592BF5B-low.gif

Once the slew rate has been calculated and meeting the constraint in Equation 4, the CSS capacitor is then calculated using Equation 5 for VIN < 3-V and IOUT ≥ 3-A applications. For all other applications, use Equation 6.

Equation 5. GUID-A6AD1D47-4B07-4390-8A91-E30899322B70-low.gif

for VIN < 3 V and IOUT ≥ 3 A

Equation 6. GUID-8D70BB6C-B70E-4034-8D49-9F52D61D8BA6-low.gif

for all other conditions