SLVSDO0F September   2018  – March 2024 TPS7H2201-SEP , TPS7H2201-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: All Devices
    6. 6.6  Electrical Characteristics: CFP and KGD Options
    7. 6.7  Electrical Characteristics: HTSSOP Option
    8. 6.8  Switching Characteristics (All Devices)
    9. 6.9  Quality Conformance Inspection
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable, Undervoltage, and Overvoltage Protection
      2. 8.3.2 Adjustable Rise Time
      3. 8.3.3 Programmable Current Limiting
      4. 8.3.4 Programmable Fault Timer
      5. 8.3.5 Current Sense
      6. 8.3.6 Parallel Operation
      7. 8.3.7 Reverse Current Protection
      8. 8.3.8 Forward Leakage Current
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Redundancy
      2. 9.2.2 Protection
      3. 9.2.3 Design Requirements
      4. 9.2.4 Detailed Design Procedure
        1. 9.2.4.1 Undervoltage Lockout
        2. 9.2.4.2 Overvoltage Protection
        3. 9.2.4.3 Current Limit
        4. 9.2.4.4 Programmable Fault Timers
        5. 9.2.4.5 Soft Start Time
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 1.5 7 V
SRVIN Input voltage slew rate 0.01 V/µs
VOUT Output voltage 0 7 (1) V
IMAX Maximum continuous switch current 6 A
TJ Operating junction temperature(2) –55 125 °C
(1) This maximum VOUT voltage is only applicable when the device is disabled (EN = Low). When the device is enabled (EN = High), the
maximum VOUT voltage is the input voltage, VIN.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the equation: TA(max) = TJ(max) – (θJA × PD(max)).