SLVSDO0F September 2018 – March 2024 TPS7H2201-SEP , TPS7H2201-SP
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC (1) | TPS7H2201-SP | TPS7H2201-SEP | UNIT | |
---|---|---|---|---|
HKR (CFP) | DAP (HTSSOP) | |||
16 PINS | 32 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 72.3 | 23.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 96.1 | 11.2 | |
RθJB | Junction-to-board thermal resistance | 42.1 | 5.4 | |
ψJT | Junction-to-top characterization parameter | 3.3 | 0.1 | |
ψJB | Junction-to-board characterization parameter | 42.5 | 5.4 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.6 | 0.5 |