SLVSGP1A August   2022  – October 2022 TPS7H2221-SEP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Derating Curves
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuit and Timing Waveforms Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Output Short Circuit Protection (ISC)
      3. 8.3.3 Fall Time (tFALL) and Quick Output Discharge (QOD)
        1. 8.3.3.1 QOD When System Power is Removed
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Limiting Inrush Current
        2. 9.2.2.2 Setting Fall Time for Shutdown Power Sequencing
        3. 9.2.2.3 Application Curves
    3. 9.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
    6. 10.6 Export Control Notice
    7. 10.7 Third-Party Products Disclaimer
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

VON ≤ VIL
Figure 6-3 Shutdown Current vs Input Voltage
ILOAD = –200 mA
Figure 6-5 On-Resistance vs Junction Temperature
Figure 6-7 VIH/VIL vs Junction Temperature
COUT = 0.1 μF ROUT = 100 Ω RQOD = 0 Ω
Figure 6-9 Turn ON Time vs Input Voltage
COUT = 0.1 μF ROUT = 100 Ω RQOD = 0 Ω
Figure 6-11 Output Slew Rate vs Input Voltage
ROUT = 100 Ω TJ = 25°C RQOD = 0 Ω
Figure 6-13 Rise Time vs Input Voltage Across Load Capacitance
COUT = 0.1 μF TJ = 25°C RQOD = 0 Ω
Figure 6-15 Turn ON Time vs Input Voltage Across Load Resistance
COUT = 0.1 μF TJ = 25°C RQOD = 0 Ω
Figure 6-17 Output Slew Rate vs Input Voltage Across Load Resistance
COUT = 0.1 μF ROUT = 100 Ω RQOD = 0 Ω
Figure 6-19 Fall Time vs Input Voltage
VON ≥ VIH
Figure 6-4 Quiescent Current vs Input Voltage
VON ≤ VIL
Figure 6-6 QOD Resistance vs Input Voltage
VON ≤ VIL
Figure 6-8 ON Pull Down Resistance vs Junction Temperature
COUT = 0.1 μF ROUT = 100 Ω RQOD = 0 Ω
Figure 6-10 Rise Time vs Input Voltage
ROUT = 100 Ω TJ = 25°C RQOD = 0 Ω
Figure 6-12 Turn ON Time vs Input Voltage Across Load Capacitance
ROUT = 100 Ω TJ = 25°C RQOD = 0 Ω
Figure 6-14 Slew Rate vs Input Voltage Across Load Capacitance
COUT = 0.1 μF TJ = 25°C RQOD = 0 Ω
Figure 6-16 Rise Time vs Input Voltage Across Load Resistance
COUT = 0.1 μF ROUT = 100 Ω RQOD = 0 Ω
Figure 6-18 Turn OFF Time vs Input Voltage
CIN = 1 μF ROUT = 100 Ω RQOD = 0 Ω
COUT = 0.1 μF
Figure 6-20 Rise Time with VIN = 1.8 V
CIN = 1 μF ROUT = 100 Ω RQOD = 0 Ω
COUT = 0.1 μF
Figure 6-22 Rise Time with VIN = 5 V
CIN = 1 μF ROUT = 100 Ω RQOD = 2k Ω
COUT = 10 μF
Figure 6-24 Turn Off with a Large Load Capacitance
CIN = 58 μF ROUT = 300m Ω RQOD = 0 Ω
COUT = 10 μF VIN = 3.3 V VON=VIN
Figure 6-26 Hot Short Event when ON
CIN = 1 μF ROUT = 100 Ω RQOD = 0 Ω
COUT = 0.1 μF
Figure 6-21 Rise Time with VIN = 3.3 V
CIN = 1 μF ROUT = 100 Ω RQOD = 2k Ω
COUT = Open
Figure 6-23 Turn Off with a Small Load Capacitance
CIN = 58 μF ROUT = 4m Ω RQOD = 0 Ω
COUT = 10 μF VIN = 3.3 V
Figure 6-25 Turn On Into an Output Short
CIN = 58 μF ROUT = 300m Ω RQOD = 0 Ω
COUT = 10 μF VIN = 3.3 V VON=VIN
Figure 6-27 Hot Short Event when ON and Recovery