SLVSGP1A August   2022  – October 2022 TPS7H2221-SEP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Derating Curves
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuit and Timing Waveforms Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Output Short Circuit Protection (ISC)
      3. 8.3.3 Fall Time (tFALL) and Quick Output Discharge (QOD)
        1. 8.3.3.1 QOD When System Power is Removed
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Limiting Inrush Current
        2. 9.2.2.2 Setting Fall Time for Shutdown Power Sequencing
        3. 9.2.2.3 Application Curves
    3. 9.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
    6. 10.6 Export Control Notice
    7. 10.7 Third-Party Products Disclaimer
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Over  VIN = 1.6 to 5.5 -V,  VON ≥ VIH , over the temperature range (TA=-55 ℃ to 125 ℃), unless otherwise specified. All voltage levels are reference to GND. 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input Supply (VIN)
IQ, VIN VIN Quiescent Current  VOUT = Open,  25 ℃ 8.3 15 µA
 VOUT = Open,  8.7 20
ISD, VIN VIN Shutdown Current VON ≤ VIL, VOUT = GND 25 ℃ 3 20 nA
VON ≤ VIL, VOUT = GND 800
ON-Resistance (RON)
RON ON-State Resistance VIN = 5 V, IOUT = -200 mA -55 ℃ 90 150 mΩ
25 ℃ 116 150
125 ℃ 150 200
VIN = 3.3 V, IOUT = -200 mA -55 ℃ 89 150 mΩ
25 ℃ 115 150
125 ℃ 150 250
VIN = 1.8 V, IOUT = -200 mA -55 ℃ 103 300 mΩ
25 ℃ 133 300
125 ℃ 173 350
Output Short Protection (ISC)
ISC Short Circuit Current Limit VOUT ≤ VIN - 1.5 V 3 A
VOUT ≤ VSC 30 512 900 mA
VSC Output Short Detection Threshold 25 ℃ 0.22 0.36 0.57 V
TSD Thermal Shutdown Rising 180 ℃
Falling 145
Enable Pin (ON)
ION ON Pin Leakage VON ≥ VIH 100 nA
RPD, ON Smart Pull Down Resistance VON ≤ VIL 499 kΩ
VIH,ON ON Pin Input High (VIH Rising) 1 V
VIL,ON ON Pin Input Low (VIL Falling) 0.35
Quick-output Discharge (QOD)
RPD, QOD QOD Pin Internal Discharge Resistance VON ≤ VIL VIN = 1.8-V 45.4 Ω
VIN = 3.3-V 8.5
VIN = 5-V 6