SLVSCJ5C December   2015  – September 2024 TPS7H3301-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT/VO Sink and Source Regulator
      2. 7.3.2 Reference Input (VDDQSNS)
      3. 7.3.3 Reference Output (VTTREF)
      4. 7.3.4 EN Control (EN)
      5. 7.3.5 Power-Good Function (PGOOD)
      6. 7.3.6 VTT Current Protection
      7. 7.3.7 VIN UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD/VIN Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 VTT Output Capacitor
        4. 8.2.2.4 VTTSNS Connection
        5. 8.2.2.5 Low VIN Applications
        6. 8.2.2.6 S3 and Pseudo-S5 Support
        7. 8.2.2.7 Tracking Startup and Shutdown
        8. 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
        9. 8.2.2.9 LDO Design Guidelines
      3. 8.2.3 Application Curve
  10.   Power Supply Recommendations
  11. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  12. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TPS7H3301-SP HKR Package,16-Pin CFP(Top View)Figure 5-1 HKR Package,16-Pin CFP(Top View)
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
VTTREF 1 O Reference output. Connect to GND through 0.1-µF ceramic capacitor.
VDDQSNS 2 I VDDQ sense input. Reference input for VTTREF.
VLDOIN 3 I Supply voltage for the LDO. Connect to VDDQ voltage or an alternate voltage source.
4
5
PGND 6 — Power ground. Connect output for the VTT/VO LDO to negative pin of the output capacitor.
7
8
EN 9 I Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device.
VDD/VIN 10 I 2.5- or 3.3-V power supply. A ceramic decoupling capacitor with a value between 1 and 10 µF is required.
PGOOD 11 O PGOOD output pin. PGOOD pin is an open drain output to indicate the output voltage is within specification.
VTT/VO 12 O Power output for VTT/VO LDO.
13
14
AGND 15 — Signal ground. Connect to negative pin of output capacitors.(1)
VTTSNS 16 I Voltage sense for VTT/VO. Connect to positive pin of the output capacitor or the load.
(1) Thermal pad and package lid are internally connected to ground.