SLVSCJ5C December   2015  – September 2024 TPS7H3301-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT/VO Sink and Source Regulator
      2. 7.3.2 Reference Input (VDDQSNS)
      3. 7.3.3 Reference Output (VTTREF)
      4. 7.3.4 EN Control (EN)
      5. 7.3.5 Power-Good Function (PGOOD)
      6. 7.3.6 VTT Current Protection
      7. 7.3.7 VIN UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD/VIN Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 VTT Output Capacitor
        4. 8.2.2.4 VTTSNS Connection
        5. 8.2.2.5 Low VIN Applications
        6. 8.2.2.6 S3 and Pseudo-S5 Support
        7. 8.2.2.7 Tracking Startup and Shutdown
        8. 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
        9. 8.2.2.9 LDO Design Guidelines
      3. 8.2.3 Application Curve
  10.   Power Supply Recommendations
  11. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  12. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Layout Guidelines

Consider the following points before starting the TPS7H3301-SP layout design.

  • The input bypass capacitor for VLDOIN should be placed as close as possible to the pin with short and wide connections.
  • The output capacitor for VTT/VO should be placed close to the pin with short and wide connection in order to avoid additional ESR and/or ESL trace inductance.
  • VTTSNS should be connected to the positive node of VTT/VO output capacitors as a separate trace from the high-current power line. This configuration is strongly recommended to avoid additional ESR and/or ESL. If sensing the voltage at the point of the load is required, it is recommended to attach the output capacitor or capacitors at that point. Also, it is recommended to minimize any additional ESR and/or ESL of ground trace between the GND pin and the output capacitor or capacitors.
  • Consider adding low-pass filter at VTTSNS if the ESR of the VTT/VO output capacitor or capacitors is larger than 2 mΩ.
  • VDDQSNS can be connected separately from VLDOIN. Remember that this sensing potential is the reference voltage of VTTREF. Avoid any noise-generating lines.
  • The negative node of the VTT/VO output capacitor or capacitors and the VTTREF capacitor should be tied together by avoiding common impedance to the high-current path of the VTT/VO sink and source current.
  • The GND and PGND pins should be connected to the thermal land underneath the die pad with multiple vias connecting to the internal system ground planes (for better result, use at least two internal ground planes). Use as many vias as possible to reduce the impedance between PGND/GND and the system ground plane. Also, place bulk caps close to the DIMM/module or memory load point and route the VTTSNS to the DIMM/module load sense point.
  • In order to effectively remove heat from the package, properly prepare the thermal land. Apply solder directly to the package’s thermal pad. The wide traces of the component and the side copper connected to the thermal land pad help to dissipate heat. Numerous vias, 0.33 mm in diameter or smaller, connected from the thermal land to the internal/solder side ground plane or planes should also be used to help dissipation.