SLVSGX6B February   2023  – December 2023 TPS7H3302-SEP , TPS7H3302-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT Sink and Source Regulator
      2. 7.3.2 Reference Input (VDDQSNS)
      3. 7.3.3 Reference Output (VTTREF)
      4. 7.3.4 EN Control (EN)
      5. 7.3.5 Power-Good Function (PGOOD)
      6. 7.3.6 VTT Current Protection
      7. 7.3.7 VIN UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 VTT Output Capacitor
        4. 8.2.2.4 VTTSNS Connection
        5. 8.2.2.5 Low VDD Applications
        6. 8.2.2.6 S3 and Pseudo-S5 Support
        7. 8.2.2.7 Tracking Startup and Shutdown
        8. 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
        9. 8.2.2.9 LDO Design Guidelines
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • QMLP TPS7H3302-SP standard microcircuit drawing (SMD) available, 5962R14228
  • Space Ehanced Plastic Vendor item drawing available, VID V62/22615
  • Total ionizing dose (TID) charactericized
    • Radiation hardness assured (RHA) qualified up to total ionizing dose (TID) 100 krad(Si) or 50 krad(Si)
  • Single-Event Effects (SEE) Charactericized
    • Single event latch-up (SEL), single event gate rupture (SEGR), single event burnout (SEB) immune up to LET = 70 MeV-cm2 /mg
    • Single event transient (SET), single event functional interrupt (SEFI), and single event upset (SEU) characterized up to 70 MeVcm2 /mg
  • Supports DDR, DDR2, DDR3, DDR3L, and DDR4 termination applications
  • Input voltage: supports a 2.5-V and 3.3-V rail
  • Separate low-voltage input (VLDOIN) down to
    0.9 V for improved power efficiency
  • 3-A sink and source termination regulator
  • Enable input and power-good output for power supply sequencing
  • VTT termination regulator
    • Output voltage range: 0.5 to 1.75 V
    • 3-A sink and source current
  • Integrated precision voltage divider network with sense input
  • Remote sensing (VTTSNS)
  • VTTREF buffered reference
    • 49% to 51% accuracy with respect to VDDQSNS (±3 mA)
    • ±10 mA sink and source current
  • Undervoltage lockout (UVLO) and overcurrent limit (OCL) functionality integrated
  • Plastic package