SLVSEN7D april 2019 – may 2023 TPS7H4001-SP
PRODMIX
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TPS7H4001-SP | UNIT | ||
---|---|---|---|---|
CDFP | HTSSOP | |||
34 PINS | 44 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 25.3 | 23.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 9.5 | 12.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.5 | 1.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 9.5 | 6.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 3.4 | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 9.3 | 6.7 | °C/W |