SNVSBL0A November   2020  – December 2021 TPS7H4010-SEP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Synchronous Step-Down Regulator
      2. 7.3.2  Auto Mode and FPWM Mode
      3. 7.3.3  Fixed-Frequency Peak Current-Mode Control
      4. 7.3.4  Adjustable Output Voltage
      5. 7.3.5  Enable and UVLO
      6. 7.3.6  Internal LDO, VCC_UVLO, and BIAS Input
      7. 7.3.7  Soft Start and Voltage Tracking
      8. 7.3.8  Adjustable Switching Frequency
      9. 7.3.9  Frequency Synchronization and Mode Setting
      10. 7.3.10 Internal Compensation and CFF
      11. 7.3.11 Bootstrap Capacitor and VBOOT-UVLO
      12. 7.3.12 Power-Good and Overvoltage Protection
      13. 7.3.13 Overcurrent and Short-Circuit Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 DCM Mode
        3. 7.4.3.3 PFM Mode
        4. 7.4.3.4 Fault Protection Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Output Voltage Setpoint
        2. 8.2.2.2  Switching Frequency
        3. 8.2.2.3  Input Capacitors
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Feed-Forward Capacitor
        7. 8.2.2.7  Bootstrap Capacitors
        8. 8.2.2.8  VCC Capacitor
        9. 8.2.2.9  BIAS
        10. 8.2.2.10 Soft Start
        11. 8.2.2.11 Undervoltage Lockout Setpoint
        12. 8.2.2.12 PGOOD
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout For EMI Reduction
      2. 10.1.2 Ground Plane
      3. 10.1.3 Optimize Thermal Performance
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNP|30
  • KGD|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range of –55°C to +125°C (unless otherwise noted)(1)
MIN MAX UNIT
Input voltages PVIN to PGND –0.3 36 V
EN to AGND –0.3 PVIN + 0.3
FB, RT, SS/TRK to AGND –0.3 5
PGOOD to AGND –0.3 20
SYNC to AGND –0.3 5.5
BIAS to AGND –0.3 Lower of (PVIN + 0.3) or 20
AGND to PGND –0.3 0.3
Output voltages SW to PGND –0.3 PVIN + 0.3 V
SW to PGND less than 10-ns transients –3.5 36
CBOOT to SW –0.3 5
VCC to AGND –0.3 5
TJ Junction temperature –55 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.