SNVS983A April   2024  – August 2024 TPS7H4011-SP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspection
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2  Voltage Reference
      3. 8.3.3  Remote Sensing and Setting VOUT
        1. 8.3.3.1 Minimum Output Voltage
        2. 8.3.3.2 Maximum Output Voltage
      4. 8.3.4  Enable
      5. 8.3.5  Fault Input (FAULT)
      6. 8.3.6  Power Good (PWRGD)
      7. 8.3.7  Adjustable Switching Frequency and Synchronization
        1. 8.3.7.1 Internal Clock Mode
        2. 8.3.7.2 External Clock Mode
        3. 8.3.7.3 Primary-Secondary Synchronization
      8. 8.3.8  Turn-On Behavior
        1. 8.3.8.1 Soft-Start (SS_TR)
        2. 8.3.8.2 Safe Start-Up Into Prebiased Outputs
        3. 8.3.8.3 Tracking and Sequencing
      9. 8.3.9  Protection Modes
        1. 8.3.9.1 Overcurrent Protection
          1. 8.3.9.1.1 High-Side 1 Overcurrent Protection (HS1)
          2. 8.3.9.1.2 High-Side 2 Overcurrent Protection (HS2)
          3. 8.3.9.1.3 COMP Shutdown
          4. 8.3.9.1.4 Low-Side Overcurrent Sinking Protection
        2. 8.3.9.2 Output Overvoltage Protection (OVP)
        3. 8.3.9.3 Thermal Shutdown
      10. 8.3.10 Error Amplifier and Loop Response
        1. 8.3.10.1 Error Amplifier
        2. 8.3.10.2 Power Stage Transconductance
        3. 8.3.10.3 Slope Compensation
        4. 8.3.10.4 Frequency Compensation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Operating Frequency
        2. 9.2.2.2  Output Inductor Selection
        3. 9.2.2.3  Output Capacitor Selection
        4. 9.2.2.4  Input Capacitor Selection
        5. 9.2.2.5  Soft-Start Capacitor Selection
        6. 9.2.2.6  Rising VIN Set Point (Configurable UVLO)
        7. 9.2.2.7  Output Voltage Feedback Resistor Selection
        8. 9.2.2.8  Output Voltage Accuracy
        9. 9.2.2.9  Slope Compensation Requirements
        10. 9.2.2.10 Compensation Component Selection
        11. 9.2.2.11 Schottky Diode
      3. 9.2.3 Application Curve
      4. 9.2.4 Parallel Operation Compensation
      5. 9.2.5 Inverting Buck-Boost
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HLB|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.3.9.1.3 COMP Shutdown

Since the voltage on the COMP pin is proportional to the device output current, by clamping the COMP voltage, another method is achieved to protect the device from overcurrent events. Specifically, if COMP rises above COMPSHDN (typically 1.9V), the part will shutdown after a small delay time, tCOMP(delay).

This feature is a complement to the HS1 and HS2 current limits. Since the slew rate of COMP is limited by the overall loop bandwidth and by the drive strength of the error amplifier, the time it takes COMP to reach COMPSHDN during a fault depends on the loop compensation and specific type of fault. During most faults, HS1 will be reached before COMP reaches COMPSHDN. HS2 will often be reached before COMP reaches COMPSHDN; however depending on the fault type, COMP may reach COMPSHDN and disable the part before HS2 is reached. Consequently, COMPSHDN can be thought of as a type of fail-safe.

After COMP reaches COMPSHDN and tCOMP(delay) passes, the device stops switching and begins discharging the SS_TR pin through a pull-down resistance, RSS(discharge) (typically 442Ω). The part will not attempt a restart until SS_TR has discharged to SSstartup (typically 20mV). This provides a cool down period for the TPS7H4011. Note that this discharge time is directly dependent upon the value of the soft start capacitor, CSS. An example of the COMP shutdown functionality is shown in the simplified waveforms of Figure 8-17.

TPS7H4011-SP COMP Shutdown Protection Figure 8-19 COMP Shutdown Protection

Additionally, COMP may reach COMPSHDN if an aggressive load step is applied to the output load and a high loop bandwidth is utilized. This is because in this situation, COMP can slew higher faster than the load can respond. This can be avoided through a compensation network that is appropriately designed for the worse case load step.