SNVS983A April   2024  – August 2024 TPS7H4011-SP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspection
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2  Voltage Reference
      3. 8.3.3  Remote Sensing and Setting VOUT
        1. 8.3.3.1 Minimum Output Voltage
        2. 8.3.3.2 Maximum Output Voltage
      4. 8.3.4  Enable
      5. 8.3.5  Fault Input (FAULT)
      6. 8.3.6  Power Good (PWRGD)
      7. 8.3.7  Adjustable Switching Frequency and Synchronization
        1. 8.3.7.1 Internal Clock Mode
        2. 8.3.7.2 External Clock Mode
        3. 8.3.7.3 Primary-Secondary Synchronization
      8. 8.3.8  Turn-On Behavior
        1. 8.3.8.1 Soft-Start (SS_TR)
        2. 8.3.8.2 Safe Start-Up Into Prebiased Outputs
        3. 8.3.8.3 Tracking and Sequencing
      9. 8.3.9  Protection Modes
        1. 8.3.9.1 Overcurrent Protection
          1. 8.3.9.1.1 High-Side 1 Overcurrent Protection (HS1)
          2. 8.3.9.1.2 High-Side 2 Overcurrent Protection (HS2)
          3. 8.3.9.1.3 COMP Shutdown
          4. 8.3.9.1.4 Low-Side Overcurrent Sinking Protection
        2. 8.3.9.2 Output Overvoltage Protection (OVP)
        3. 8.3.9.3 Thermal Shutdown
      10. 8.3.10 Error Amplifier and Loop Response
        1. 8.3.10.1 Error Amplifier
        2. 8.3.10.2 Power Stage Transconductance
        3. 8.3.10.3 Slope Compensation
        4. 8.3.10.4 Frequency Compensation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Operating Frequency
        2. 9.2.2.2  Output Inductor Selection
        3. 9.2.2.3  Output Capacitor Selection
        4. 9.2.2.4  Input Capacitor Selection
        5. 9.2.2.5  Soft-Start Capacitor Selection
        6. 9.2.2.6  Rising VIN Set Point (Configurable UVLO)
        7. 9.2.2.7  Output Voltage Feedback Resistor Selection
        8. 9.2.2.8  Output Voltage Accuracy
        9. 9.2.2.9  Slope Compensation Requirements
        10. 9.2.2.10 Compensation Component Selection
        11. 9.2.2.11 Schottky Diode
      3. 9.2.3 Application Curve
      4. 9.2.4 Parallel Operation Compensation
      5. 9.2.5 Inverting Buck-Boost
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HLB|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating temperature (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN, PVIN –0.3 16 V
EN, FAULT, ILIM, PWRGD, SYNC1, SYNC2, SYNCM –0.3 7.5
VSNS+, VSNS- –0.3 3.6
Output voltage SW –1 16 V
SW, 80ns transient –3 20
LDOCAP –0.3 7.5
RSC, COMP, RT, SS_TR –0.3 3.6
REFCAP –0.3 1.9
Vdiff (GND to exposed thermal pad) –0.2 0.2 V
Source current SW Current limit A
PVIN Current limit
PGND Current limit
RT –100 100 µA
Sink current SW Current limit A
PGND Current limit
COMP –200 200 µA
PWRGD –0.1 5 mA
Operating junction temperature –55 150 °C
Storage temperature, Tstg –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.