SNOSDH4A June   2024  – December 2024 TPS7H6005-SEP , TPS7H6015-SEP , TPS7H6025-SEP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Device Options Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Quality Conformance Inspection
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage
      2. 8.3.2  Linear Regulator Operation
      3. 8.3.3  Bootstrap Operation
        1. 8.3.3.1 Bootstrap Charging
        2. 8.3.3.2 Bootstrap Capacitor
        3. 8.3.3.3 Bootstrap Diode
        4. 8.3.3.4 Bootstrap Resistor
      4. 8.3.4  High-Side Driver Startup
      5. 8.3.5  Inputs and Outputs
      6. 8.3.6  Dead Time
      7. 8.3.7  Input Interlock Protection
      8. 8.3.8  Undervoltage Lockout and Power Good (PGOOD)
      9. 8.3.9  Negative SW Voltage Transients
      10. 8.3.10 Level Shifter
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bootstrap and Bypass Capacitors
        2. 9.2.2.2 Bootstrap Diode
        3. 9.2.2.3 BP5x Overshoot and Undershoot
        4. 9.2.2.4 Gate Resistor
        5. 9.2.2.5 Dead Time Resistor
        6. 9.2.2.6 Gate Driver Losses
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCA|56
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

TPS7H6005-SP TPS7H6015-SP TPS7H6025-SP TPS7H6005-SEP TPS7H6015-SEP TPS7H6025-SEP DCA Package56-Pin TSSOP(Top View) Figure 6-1 DCA Package
56-Pin TSSOP
(Top View)
Table 6-1 Pin Functions
PINI/O(1)DESCRIPTION
NUMBERNAME
8BOOTIInput voltage supply of the high-side linear regulator. The external bootstrap capacitor is placed between BOOT and ASW. The cathode of the external bootstrap diode is connected to this pin. A Zener diode clamp may be needed between BOOT and ASW in order to not exceed the absolute maximum electrical rating.
9–13ASW—High-side driver signal return. ASW(9) is internally connected to PSW and the high-side thermal pad. Connect ASW(10-13) to ASW externally.
16BSTOFor bootstrap charging that utilizes the internal bootstrap switch, this pin serves as the bootstrap diode anode connection point. The external high-side bootstrap capacitor can be charged through this pin using the input voltage applied to VIN, internal bootstrap switch, and external bootstrap diode(s).
17BP7LOLow-side 7V linear regulator output. A minimum of 1μF capacitance is required from BP7L to AGND.
18VINIGate driver input voltage supply. Input voltage range is from 10V to 14V. This pin serves as the input to the low-side linear regulators and the internal bootstrap switch. For bootstrap charging directly from the input voltage, VIN also serves as the bootstrap diode anode connection point.
15, 19, 25AGND—Low-side driver signal return. AGND(15) and AGND(19) are internally connected to PGND and the low-side thermal pad. Connect AGND(25) to AGND externally.
20DHLIHigh-side to low-side dead time set. In PWM mode, a resistor from DHL to AGND sets the dead time between the high-side turn-off and low-side turn-on. In independent input mode (IIM), DHL is used to configure the input interlock protection of the driver. DHL is connected to BP5L in IIM with interlock enabled. A resistor valued between 100kΩ and 220kΩ is connected from DHL to AGND for IIM with interlock disabled.
21DLHILow-side to high-side dead time set. In PWM mode, a resistor from DLH to AGND sets the dead time between the low-side turn-off and high-side turn-on. In independent input mode (IIM), DLH is used to configure the input interlock protection of the driver. A resistor valued between 100kΩ and 220kΩ is connected from DLH to AGND for IIM with interlock enabled. DLH is connected to BP5L in IIM with interlock disabled.
22PGOODOPower good pin. Asserts low when any of the low-side internal linear regulators or VIN goes into undervoltage lockout. Requires a 10kΩ pull-up resistor to BP5L.
23EN_HIIEnable input or high-side driver control input. In PWM mode this is used as an enable pin. In independent input mode (IIM) this serves as the control input for the high-side driver.
24PWM_LIIPWM input or low-side driver control input. In PWM mode this is used as the PWM input to the gate driver. In independent input mode (IIM) this serves as the control input for the low-side driver.
29–32, 42PGND—Low-side power ground. Connect to the source of the low-side GaN FET. Internally connected to AGND and low-side thermal pad. Connect to AGND at printed circuit board level.
33–35BP5LOLow-side 5V linear regulator output. A minimum of 1μF capacitance is required from BP5L to PGND.
36–38LOHOLow-side driver source current ouput. Connect to the gate of low-side GaN FET with short, low inductance path. A resistor between LOH and the gate of the GaN FET can be used to adjust the turn-on speed.
39–41LOLOLow-side driver sink current output. Connect to the gate of the low-side GaN FET with short, low inductance path. A resistor between LOL and the gate of the GaN FET can be used to adjust the turn-off speed.
44–47PSW— Switch node connection. Connect to the source of the high-side GaN FET. Internally connected to ASW and high-side thermal pad. Connect to ASW at printed circuit board level.
48–50BP5HOHigh-side 5V linear regulator output. A minimum of 1μF capacitance is required from BP5H to PSW.
51–53HOHOHigh-side driver source current output. Connect to the gate of the high-side GaN FET with short, low inductance path. A resistor between HOH and the gate of the GaN FET can be used to adjust the turn-on speed.
54–56HOLOHigh-side driver sink current output. Connect to the gate of the high-side GaN FET with short, low inductance path. A resistor between HOL and the gate of the GaN FET can be used to adjust the turn-off speed.
1–7, 14, 26–28, 43NC— No connect. These pins are not connected internally. Pins 1-7 and 26-28 can be left unconnected or connected to the respective reference voltage (ASW or AGND) in order to avoid floating metal and prevent charge buildup. For pins 14 and 43, these are recommended to be left unconnected in order to meet the requirements of IEC-60664 for creepage and clearance. Ultimately, the connections of pins 14 and 43 are left to the discretion of the user based on the specific creepage and clearance guidelines that are selected for the design.
—PSW PAD—High-side thermal pad. Internally connected to ASW(9) and PSW. Should be connected to ASW pins.
—PGND PAD—Low-side thermal pad. Internally connected to AGND(15), AGND(19) and PGND. Should be connected to AGND pins.
(1) I = Input, O = Output, I/O = Input or Output, — = Other