SBVS445A October   2024  – December 2024 TPS7N53

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Voltage Setting and Regulation
      2. 6.3.2 Low-Noise, Ultra-High Power-Supply Rejection Ratio (PSRR)
      3. 6.3.3 Programmable Soft-Start (SS Pin)
      4. 6.3.4 Precision Enable and UVLO
      5. 6.3.5 Power-Good Pin (PG Pin)
      6. 6.3.6 Active Discharge
      7. 6.3.7 Thermal Shutdown Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Disabled
      3. 6.4.3 Current-Limit Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1  Precision Enable (External UVLO)
      2. 7.1.2  Input and Output Capacitor Requirements (CIN and COUT)
      3. 7.1.3  Recommended Capacitor Types
      4. 7.1.4  Soft-Start (SS Pin) and Noise Reduction (NR Pin)
      5. 7.1.5  Charge Pump Noise
      6. 7.1.6  Optimizing Noise and PSRR
      7. 7.1.7  Adjustable Operation
      8. 7.1.8  Load Transient Response
      9. 7.1.9  Power-Good Functionality
      10. 7.1.10 Paralleling for Higher Output Current and Lower Noise
      11. 7.1.11 Power Dissipation (PD)
      12. 7.1.12 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) TPS7N53 UNIT
RTE (WQFN) (2)
16 PINS
RθJA Junction-to-ambient thermal resistance 42.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.1 °C/W
RθJB Junction-to-board thermal resistance 17.6 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 17.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics the application note.
(2) Evaluated using JEDEC standard (2s2p).