SLVSBR0C October   2014  – June 2015 TPS8268090 , TPS8268105 , TPS8268120 , TPS8268150 , TPS8268180

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Soft Start
      2. 8.3.2 Undervoltage Lockout
      3. 8.3.3 Short-Circuit Protection
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Enable
      6. 8.3.6 MODE Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Spread Spectrum, PWM Frequency Dithering
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Capacitor Selection
        2. 9.2.2.2 Output Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Surface Mount Information
    4. 11.4 Thermal and Reliability Information
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 References
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Summary
    2. 13.2 MicroSiP™ DC/DC Module Package Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIP|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 References

"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS8268180 Click here Click here Click here Click here Click here
TPS8268150 Click here Click here Click here Click here Click here
TPS8268120 Click here Click here Click here Click here Click here
TPS8268105 Click here Click here Click here Click here Click here
TPS8268090 Click here Click here Click here Click here Click here

12.3 Trademarks

MicroSiP is a trademark of Texas Instruments.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.