SLVSBR0C October 2014 – June 2015 TPS8268090 , TPS8268105 , TPS8268120 , TPS8268150 , TPS8268180
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
SIP PACKAGE |
TheTPS8268x is available in an 9-bump ball grid array (BGA) package. The package dimensions are: