SLVSBF8C March   2013  – May 2015 TPS82692 , TPS82693 , TPS826951 , TPS82697 , TPS82698

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Save Mode
      2. 9.3.2 Mode Selection
      3. 9.3.3 Soft Start
    4. 9.4 Device Functional Modes
      1. 9.4.1 Low Dropout, 100% Duty Cycle Operation
      2. 9.4.2 Enable
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Input Capacitor Selection
      2. 10.2.2 Output Capacitor Selection
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Surface Mount Information
    4. 12.4 Thermal And Reliability Information
    5. 12.5 Package Summary
      1.      SIP Package
    6. 12.6 MicroSIP
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.2 Layout Example

TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 landpad_lvsa57.gifFigure 45. Recommended Land Pattern Image And Dimensions
SOLDER PAD DEFINITIONS(1)(2)(3)(4) COPPER PAD SOLDER MASK (5)
OPENING		 COPPER THICKNESS STENCIL (6)
OPENING 		STENCIL THICKNESS
Non-solder-mask defined (NSMD) 0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick
(1) Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and affect reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application.
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste volume control.