SLVSBF8C March   2013  – May 2015 TPS82692 , TPS82693 , TPS826951 , TPS82697 , TPS82698

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Save Mode
      2. 9.3.2 Mode Selection
      3. 9.3.3 Soft Start
    4. 9.4 Device Functional Modes
      1. 9.4.1 Low Dropout, 100% Duty Cycle Operation
      2. 9.4.2 Enable
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Input Capacitor Selection
      2. 10.2.2 Output Capacitor Selection
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Surface Mount Information
    4. 12.4 Thermal And Reliability Information
    5. 12.5 Package Summary
      1.      SIP Package
    6. 12.6 MicroSIP
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS82693/4/51/7/8/9 UNIT
SIP (8-TERMINALS)
θJA Junction-to-ambient thermal resistance 83 °C/W
θJCtop Junction-to-case (top) thermal resistance 53 °C/W
θJB Junction-to-board thermal resistance - °C/W
ψJT Junction-to-top characterization parameter - °C/W
ψJB Junction-to-board characterization parameter - °C/W
θJCbot Junction-to-case (bottom) thermal resistance - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.