SLVSCE3A June   2014  – June 2014 TPS82740A , TPS82740B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1. 3.1 Typical Application
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2. Table 1. Output Voltage Setting TPS82740A
    3. Table 2. Output Voltage Setting TPS82740B
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 DCS-Control
      2. 9.3.2 LOAD Switch
      3. 9.3.3 Output Voltage Selection (VSEL1, VSEL2, VSEL3)
      4. 9.3.4 Output Discharge Function (VOUT and LOAD)
      5. 9.3.5 Internal Current Limit
      6. 9.3.6 CTRL / DVS (Dynamic Voltage Scaling TPS62741)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Enable / Shutdown
      2. 9.4.2 Soft Start
      3. 9.4.3 POWER GOOD OUTPUT (PG)
      4. 9.4.4 Automatic Transition into 100% Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input Capacitor Selection
          1. 10.2.2.1.1 Input Buffer Capacitor Selection
        2. 10.2.2.2 Output Capacitor Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Surface Mount Information
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIP|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.1 Layout Guidelines

In making the pad size for the uSiP LGA balls, it is recommended that the layout use a non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 46 shows the appropriate diameters for a MicroSiPTM layout. Figure 47 shows a suggestion for the PCB layout.