SLVSF29C October   2019  – August 2021 TPS8804

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Power-up
      2. 7.3.2 LDO Regulators
        1. 7.3.2.1 Power LDO Regulator
        2. 7.3.2.2 Internal LDO Regulator
        3. 7.3.2.3 Microcontroller LDO Regulator
      3. 7.3.3 Photo Chamber AFE
        1. 7.3.3.1 Photo Input Amplifier
        2. 7.3.3.2 Photo Gain Amplifier
      4. 7.3.4 LED Driver
        1. 7.3.4.1 LED Current Sink
        2. 7.3.4.2 LED Voltage Supply
      5. 7.3.5 Carbon Monoxide Sensor AFE
        1. 7.3.5.1 CO Transimpedance Amplifier
        2. 7.3.5.2 CO Connectivity Test
      6. 7.3.6 SLC Interface Transmitter and Receiver
        1. 7.3.6.1 SLC Transmitter
        2. 7.3.6.2 SLC Receiver
      7. 7.3.7 AMUX
      8. 7.3.8 Analog Bias Block and 8 MHz Oscillator
      9. 7.3.9 Interrupt Signal Alerts
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fault States
        1. 7.4.1.1 MCU LDO Fault
        2. 7.4.1.2 Over-Temperature Fault
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1  REVID Register (Offset = 0h) [reset = 0h]
      2. 7.6.2  STATUS1 Register (Offset = 1h) [reset = 0h]
      3. 7.6.3  STATUS2 Register (Offset = 2h) [reset = 0h]
      4. 7.6.4  MASK Register (Offset = 3h) [reset = 0h]
      5. 7.6.5  CONFIG1 Register (Offset = 4h) [reset = 20h]
      6. 7.6.6  CONFIG2 Register (Offset = 5h) [reset = 0h]
      7. 7.6.7  ENABLE1 Register (Offset = 6h) [reset = 0h]
      8. 7.6.8  ENABLE2 Register (Offset = 7h) [reset = 0h]
      9. 7.6.9  CONTROL Register (Offset = 8h) [reset = 0h]
      10. 7.6.10 GPIO_AMUX Register (Offset = Bh) [reset = 0h]
      11. 7.6.11 COSW Register (Offset = Ch) [reset = 0h]
      12. 7.6.12 CO Register (Offset = Dh) [reset = 0h]
      13. 7.6.13 LEDLDO Register (Offset = Fh) [reset = 0h]
      14. 7.6.14 PH_CTRL Register (Offset = 10h) [reset = 0h]
      15. 7.6.15 LED_DAC_A Register (Offset = 11h) [reset = 0h]
      16. 7.6.16 LED_DAC_B Register (Offset = 12h) [reset = 0h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Photo Amplifier Component Selection
        2. 8.2.2.2 LED Driver Component Selection
        3. 8.2.2.3 LED Voltage Supply Selection
        4. 8.2.2.4 Regulator Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Photo Amplifier Layout
      2. 10.1.2 CO Amplifier Layout
      3. 10.1.3 Ground Plane Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1.2 Over-Temperature Fault

An over-temperature shutdown (OTS) fault occurs if OTS_EN = 1 and the die temperature exceeds 125°C. The fault is masked for 300 μs after setting OTS_EN = 1. OTS_EN must be enabled for at least 300 μs in order to determine if the die has overheated. After the device detects an over-temperature condition, it disables all drivers, amplifiers, and regulators and sets OTS_ERR to 1. This action prevents additional temperature stress caused by a short circuit.

Similar to the MCU LDO fault, the device exits the OTS fault state with two methods:

  • The device checks the die temperature once every second. If the temperature is below 110°C, the device exits the fault state.
  • Reading the STATUS1 register with the die temperature below 110°C exits the fault state.

When the device exits the OTS fault state, it re-enables all blocks that were enabled before the OTS fault occurred.