SNVSBY8 March   2021 TPS92391

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface Characteristics
    7. 6.7 Timing Requirements for I2C Interface
    8.     14
    9. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Interface
      2. 7.3.2 Function Setting
      3. 7.3.3 Device Supply (VDD)
      4. 7.3.4 Enable (EN)
      5. 7.3.5 Charge Pump
      6. 7.3.6 Boost Controller
        1. 7.3.6.1 Boost Cycle-by-Cycle Current Limit
        2. 7.3.6.2 Controller Min On/Off Time
        3. 7.3.6.3 Boost Adaptive Voltage Control
          1. 7.3.6.3.1 FB Divider Using Two-Resistor Method
          2. 7.3.6.3.2 FB Divider Using Three-Resistor Method
          3. 7.3.6.3.3 FB Divider Using External Compensation
        4. 7.3.6.4 Boost Sync and Spread Spectrum
        5. 7.3.6.5 Light Load Mode
      7. 7.3.7 LED Current Sinks
        1. 7.3.7.1 LED Output Current Setting
        2. 7.3.7.2 LED Output String Configuration
        3. 7.3.7.3 LED Output PWM Clock Generation
      8. 7.3.8 Brightness Control
        1. 7.3.8.1 Brightness Control Signal Path
        2. 7.3.8.2 Dimming Mode
        3. 7.3.8.3 LED Dimming Frequency
        4. 7.3.8.4 Phase-Shift PWM Mode
        5. 7.3.8.5 Hybrid Mode
        6. 7.3.8.6 Direct PWM Mode
        7. 7.3.8.7 Sloper
        8. 7.3.8.8 PWM Detector Hysteresis
        9. 7.3.8.9 Dither
      9. 7.3.9 Protection and Fault Detections
        1. 7.3.9.1 Supply Faults
          1. 7.3.9.1.1 VIN Undervoltage Faults (VINUVLO)
          2.        51
          3. 7.3.9.1.2 VIN Overvoltage Faults (VINOVP)
          4. 7.3.9.1.3 VDD Undervoltage Faults (VDDUVLO)
          5. 7.3.9.1.4 VIN OCP Faults (VINOCP)
            1. 7.3.9.1.4.1 VIN OCP Current Limit vs. Boost Cycle-by-Cycle Current Limit
          6. 7.3.9.1.5 Charge Pump Faults (CPCAP, CP)
          7. 7.3.9.1.6 CRC Error Faults (CRCERR)
        2. 7.3.9.2 Boost Faults
          1. 7.3.9.2.1 Boost Overvoltage Faults (BSTOVPL, BSTOVPH)
          2. 7.3.9.2.2 Boost Overcurrent Faults (BSTOCP)
          3. 7.3.9.2.3 LEDSET Resistor Missing Faults (LEDSET)
          4. 7.3.9.2.4 MODE Resistor Missing Faults (MODESEL)
          5. 7.3.9.2.5 FSET Resistor Missing Faults (FSET)
          6. 7.3.9.2.6 ISET Resistor Out of Range Faults (ISET)
          7. 7.3.9.2.7 Thermal Shutdown Faults (TSD)
        3. 7.3.9.3 LED Faults
          1. 7.3.9.3.1 Open LED Faults (OPEN_LED)
          2. 7.3.9.3.2 Short LED Faults (SHORT_LED)
          3. 7.3.9.3.3 LED Short to GND Faults (GND_LED)
          4. 7.3.9.3.4 Invalid LED String Faults (INVSTRING)
          5. 7.3.9.3.5 I2C Timeout Faults
        4. 7.3.9.4 Overview of the Fault and Protection Schemes
    4. 7.4 Device Functional Modes
      1. 7.4.1  State Diagram
      2. 7.4.2  Shutdown
      3. 7.4.3  Device Initialization
      4. 7.4.4  Standby Mode
      5. 7.4.5  Power-line FET Soft Start
      6. 7.4.6  Boost Start-Up
      7. 7.4.7  Normal Mode
      8. 7.4.8  Fault Recovery
      9. 7.4.9  Latch Fault
      10. 7.4.10 Start-Up Sequence
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
      2. 7.5.2 Programming Examples
        1. 7.5.2.1 General Configuration Registers
        2. 7.5.2.2 Clearing Fault Interrupts
        3. 7.5.2.3 Disabling Fault Interrupts
        4. 7.5.2.4 Diagnostic Registers
    6. 7.6 Register Maps
      1. 7.6.1 FullMap Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Full Feature Application for Display Backlight
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Inductor Selection
          2. 8.2.1.2.2  Output Capacitor Selection
          3. 8.2.1.2.3  Input Capacitor Selection
          4. 8.2.1.2.4  Charge Pump Output Capacitor
          5. 8.2.1.2.5  Charge Pump Flying Capacitor
          6. 8.2.1.2.6  Output Diode
          7. 8.2.1.2.7  Switching FET
          8. 8.2.1.2.8  Boost Sense Resistor
          9. 8.2.1.2.9  Power-Line FET
          10. 8.2.1.2.10 Input Current Sense Resistor
          11. 8.2.1.2.11 Feedback Resistor Divider
          12. 8.2.1.2.12 Critical Components for Design
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application With Basic/Minimal Operation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 SEPIC Mode Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1  Inductor Selection
          2. 8.2.3.2.2  Coupling Capacitor Selection
          3. 8.2.3.2.3  Output Capacitor Selection
          4. 8.2.3.2.4  Input Capacitor Selection
          5. 8.2.3.2.5  Charge Pump Output Capacitor
          6. 8.2.3.2.6  Charge Pump Flying Capacitor
          7. 8.2.3.2.7  Switching FET
          8. 8.2.3.2.8  Output Diode
          9. 8.2.3.2.9  Switching Sense Resistor
          10. 8.2.3.2.10 Power-Line FET
          11. 8.2.3.2.11 Input Current Sense Resistor
          12. 8.2.3.2.12 Feedback Resistor Divider
          13. 8.2.3.2.13 Critical Components for Design
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
Voltage on pins VSENSE_N, SD, UVLO –0.3 VSENSE_P + 0.3 V
Voltage on pins VSENSE_P, FB , OUT1 to OUT6 –0.3 52 V
C1N, C1P, VDD, EN, ISNS, ISNS_GND, INT, MODE, PWM_FSET, BST_FSET, LED_SET, ISET, GD and CPUMP –0.3 6 V
Voltage on pins PWM, BST_SYNC, SDA, SCL –0.3 VDD + 0.3 V
Continuous power dissipation(3) Internally Limited W
Thermal Ambient temperature, TA(4) –40 125
Junction temperature, TJ(4) –40 150 °C
Lead temperature (soldering) 260 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typical) and disengages at TJ = 150°C (typical).
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX = 150°C), the power dissipation of the device in the application (P), the junction-to-board thermal resistance and the temperature difference between the system board and the ambient (ΔtBA), which is given by the following equation: TA-MAX = TJ-MAX – (ΘJB × P) - ΔtBA