SNVS901A March   2014  – May 2014 TPS92511

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Pulse Level Modulation (PLM) Control
      2. 7.3.2  Pulse Level Modulation (PLM) Operaion Principles
      3. 7.3.3  PLM Control enable Common-Anode Low-Side Sensing (CALS)Technique to Save Wiring
      4. 7.3.4  Internal Regulator
      5. 7.3.5  Setting The Switching Frequency
      6. 7.3.6  Setting The LED Current
      7. 7.3.7  Integrated MOSFET
      8. 7.3.8  Inductor Selection
      9. 7.3.9  Integrated MOSFET Current Limit
      10. 7.3.10 PWM Dimming Control
      11. 7.3.11 Analog Dimming
      12. 7.3.12 High Voltage Buck Configuration
      13. 7.3.13 Thermal Foldback
      14. 7.3.14 EMI Consideration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN < 4.5 V (minimum VIN)
      2. 7.4.2 Operation with DIM control
      3. 7.4.3 Linear Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS92511 LED driver for 12 LEDs at 0.5A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Thermal Consideration
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings (1)

Unless otherwise specified, TJ = TA = 25°C
MIN NOM MAX UNIT
Pin voltage range VIN to GND –0.3 65 V
VIN to GND (Transient) –0.3 67 V
LX to PGND –0.3 65 V
LX to PGND (Transient) –3(2ns) 67 V
FS, IADJ to GND –0.3 5 V
DIM to GND –0.3 6 V
VCC to GND –0.3 7 V
Temperature range Operating junction temperature range, TJ –40 Internally limited °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specified specifications and test conditions, see the Electrical Characteristics.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range -65 150 °C
VESD(1) Human Body Model (HBM) ESD stress voltage (2) 1.5 kV
Charged Device Model (CDM) ESD stress voltage(3) 1.5 kV
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Supply voltage range 4.5 65 V
TA Operating free air temperature –40 125 °C
TJ Operating junction temperature -40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS92511 UNIT
DDA
8 PINS
RθJA Junction-to-ambient thermal resistance 59.9 °C/W
RθJCtop Junction-to-case (top) thermal resistance 59.1
RθJB Junction-to-board thermal resistance 30.6
ψJT Junction-to-top characterization parameter 11.0
ψJB Junction-to-board characterization parameter 30.5
RθJCbot Junction-to-case (bottom) thermal resistance 4.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified, -40°C ≤ TJ = TA ≤ 125°C, VIN = 48 V
PARAMETER CONDITIONS MIN TYP MAX UNIT
SYSTEM
IIN-DIM-HIGH VIN Operating Current 4.5 V ≤ VIN ≤ 65 V, RIADJ = 3 kΩ, VDIM = High 2.8 3.15 mA
IIN-DIM-LOW VIN Standby Current 4.5 V ≤ VIN ≤ 65 V, RIADJ = 3 kΩ, VDIM = Low 2.3 2.7 mA
ILX-OFF LX Pin Current Main switch turned OFF, VLX = VIN = 65 V 0.1 1.0 µA
ILED Average LED Current VFS = 4.6V, RIADJ = 3 kΩ, TA = 25°C 484 502 520 mA
VFS = 4.6V, RIADJ = 3 kΩ 477 502 528 mA
VFS = 4.6V, RIADJ = 6 kΩ, TA = 25°C 236 249 262 mA
VFS = 4.6V, RIADJ = 6 kΩ 233 249 268 mA
VFS = 4.6V, RIADJ = 10 kΩ, TA = 25°C 138 149 160 mA
VFS = 4.6V, RIADJ = 10 kΩ 133 149 166 mA
VIADJ IADJ Pin voltage 1.224 1.25 1.278 V
VDIM-ON DIM Pin Upper Threshold VDIM Increasing 0.85 1.0 1.25 V
VDIM-OFF DIM Pin Lower Threshold VDIM Decreasing 0.44 V
VDIM-HYS DIM Pin Threshold Hysteresis 325 mV
fSW Switching frequency RFS = 20 kΩ 450 500 550 kHz
ton(min) Minimum On-time 250 400 ns
INTERNAL REGULATOR
VCC VCC Regulated Output Voltage CVCC =1 µF, no load 4.7 5.4 6.0 V
CVCC =1 µF, VIN = 4.5V, 2 mA load 3.7 4.1 V
VCC-UVLO-ON VCC UVLO Upper Threshold VCC rising 3.50 3.75 4.00 V
VCC-UVLO-OFF VCC UVLO Lower Threshold VCC falling 3.05 V
VCC-UVLO-HYS VCC UVLO Hysteresis 275 mV
INTEGRATED MOSFET
RLX Resistance Across LX and GND Main Switch Turned ON, TA = 25°C 1.4 2.15 Ω
THERMAL SHUTDOWN
TSD Thermal shutdown temperature TJ Rising 165 °C
TSD-HYS Thermal shutdown hysteresis TJ Falling 10

6.6 Typical Characteristics

Unless otherwise specified, all curves are taken at VIN = 48V with configuration in the application circuit for driving 12 LEDs with ILED = 0.5A and fSW = 300 kHz as shown in this datasheet, and TA = 25°C.
sva30207543_nvs901.png
Figure 1. IIN vs VIN
sva30207559_nvs901.png
Figure 3. VCC vs VIN
rdsonT_snvs901.png
Figure 5. RLX vs Temperature
Regulation500_snvs901.png
Figure 7. ILED at 500 mA vs Temperature
Regulation150_snvs901.png
Figure 9. ILED at 150 mA vs Temperature
Dimming100_snvs901.png
Figure 11. PWM Dimming Linearity (0-100%) (fSW = 500kHz, L1 = 68 µH
sva30207544_nvs901.png
Figure 2. VCC vs IVCC
sva30207560_nvs901.png
Figure 4. VIADJ vs Temperature
fswT_sncs901.png
Figure 6. fSW vs Temperature
Regulation250_snvs901.png
Figure 8. ILED at 250 mA vs Temperature
IINvsVIN@short_snvs901.png
Figure 10. IIN vs VIN at LED Short
Dimming1_snvs901.png
Figure 12. PWM Dimming Linearity (under 1%) (fSW = 500kHz, L1 = 68 µH