SLVSCT1B February   2015  – April 2015 TPS92512 , TPS92512HV

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematics
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout and Low Power Shutdown (UVLO Pin)
      2. 8.3.2 Adjustable Switching Frequency (RT/CLK Pin)
      3. 8.3.3 Synchronizing the Switching Frequency to an External Clock (RT/CLK Pin)
      4. 8.3.4 Adjustable LED Current (IADJ and ISENSE Pins)
      5. 8.3.5 PWM Dimming (PDIM Pin)
      6. 8.3.6 External Compensation (COMP Pin)
      7. 8.3.7 Overcurrent Protection
      8. 8.3.8 Overtemperature Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Minimum Pulse Width and Limitations
      3. 8.4.3 Maximum Duty Cycle and Bootstrap Voltage (BOOT)
      4. 8.4.4 Thermal Shutdown and Thermal Limitations
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inductor Selection
      2. 9.1.2 Input Capacitor Selection
      3. 9.1.3 Output Capacitor Selection
      4. 9.1.4 Rectifier Diode Selection
      5. 9.1.5 Output Protection Clamp (Optional)
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
      1. 9.4.1 Standard Component Selection
      2. 9.4.2 Calculate UVLO Resistor Values
      3. 9.4.3 Calculate the RT Resistor Value (RRT)
      4. 9.4.4 Calculate the ISENSE Resistor Value (R(ISENSE))
      5. 9.4.5 Calculate the Inductor Value and Operating Parameters (L)
      6. 9.4.6 Calculate the Minimum Input Capacitance and the Required RMS Current Rating (CIN)
      7. 9.4.7 Calculate the Output Capacitor Value (COUT)
      8. 9.4.8 Calculate the Diode Power Dissipation (D)
    5. 9.5 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage VIN (TPS92512HV) –0.3 65 V
VIN (TPS92512) –0.3 45
PDIM, UVLO –0.3 5
BOOT (PH + 8)
ISENSE, IADJ, COMP –0.3 3
RT/CLK –0.3 3.6
Output voltage PH (TPS92512HV) –0.6 65 V
PH (TPS92512) –0.6 45
PH, 10-ns Transient –2
Voltage Difference PAD to GND ±200 mV
Source Current PH Current Limit A
Sink current VIN Current Limit A
BOOT 1 mA
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM),ESD stress voltage(1) ±2000 V
Charged-device model (CDM), ESD stress voltage(2) ±500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2 kV may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage (TPS92512HV) 4.5 60 V
Input voltage (TPS92512) 4.5 42
fSW Switching frequency range using RT mode 100 2000 kHz
Switching frequency range using CLK mode 300 2000
tMIN(RT/CLK) Minimum RT/CLK input pulse width for switching frequency synchronization 51 ns
TJ Operating junction temperature –40 125 °C

7.4 Thermal Information

THERMAL METRIC(1) TPS92512
TPS92512HV
UNIT
DGQ (10 PINS)
RθJA Junction-to-ambient thermal resistance 66.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.8
RθJB Junction-to-board thermal resistance 37.5
ψJT Junction-to-top characterization parameter 1.8
ψJB Junction-to-board characterization parameter 37.1
RθJC(bot) Junction-to-case (bottom) thermal resistance 15.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

–40°C ≤ TJ ≤ 125°C, VVIN = 12V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN)
VINUVLO VIN undervoltage lockout threshold No voltage hysteresis, rising and falling 2.94 V
IVINSD Shutdown supply current VUVLO = 0 V, 4.5 V ≤ VVIN ≤ 42 V (60 V for HV) 11.5 µA
IVIN Non-switching supply current VISENSE = 220 mV, 4.5V ≤ VVIN ≤ 42 V (60 V for HV) 337 407 µA
UNDER VOLTAGE LOCKOUT (UVLO)
VUVLO UVLO threshold voltage Rising threshold 1.12 1.22 1.30 V
UVLO pin source current VUVLO = 1.5 V (device enabled) 3.97 µA
VUVLO = 1 V (device disabled) 1.05
ANALOG CURRENT ADJUST (VIADJ, VISENSE)
VIADJ IADJ clamp voltage IIADJ = 1 µA 1.8 V
IIADJ = 100 µA 2.77
VISENSE Current sense voltage VIADJ = 1.2 V, TJ = 25°C to 125°C 191 200 210 mV
VIADJ = 0.18 V, TJ = 25°C to 125°C 21.4 30.0 40.0
IIADJ = 1 µA, TJ = 25°C to 125°C 285 300 309
IIADJ = 100 µA, TJ = 25°C to 125°C 286 300 309
Current sense voltage level 180 mV ≤ VIADJ ≤ 1.8V VIADJ/6
HIGH-SIDE MOSFET (BOOT, PH)
RDS(on) On-resistance VVIN = 4.5 V, (VBOOT – VPH) = 3.5 V 232
(VBOOT – VPH) = 6 V 200 342
VBOOT BOOT-PH voltage VPDIM = 3V 6 V
IBOOT BOOT-PH current VPDIM = 0V, (VBOOT – VPH) = 5V 93.9 µA
VBOOTUV BOOT-PH under voltage lockout Rising threshold 2.25 2.81 V
Falling threshold 1.99 2.40
tON(min) Minimum on time VCOMP = 0 140 ns
ERROR AMPLIFIER (ISENSE, COMP)
Input bias current VISENSE = 200 mV 20 nA
gM(ea) Transconductance gain VIADJ = 1.2 V, 180 mV < VISENSE < 220 mV, VCOMP = 1 V 331 µA/V
DC gain VIADJ = 1.2 V , VISENSE = 0.2 V 10 kV/V
Bandwidth 2.7 MHz
Source/sink current VIADJ = 1.2 V , VCOMP = 1 V,
VISENSE = 200 mV ± 100 mV
±28 µA
CURRENT LIMIT
Current limit threshold 6 A
THERMAL SHUTDOWN
TSD Thermal shutdown 165 °C
Thermal shutdown hysteresis 20
TIMING RESISTOR AND EXTERNAL CLOCK (RT/CLK)
VRT RT/CLK regulated voltage RRT = 200 kΩ 474 500 513 mV
fSW Switching frequency VVIN = 6 V, RRT = 200 kΩ 447 557 648 kHz
RT/CLK high threshold VVIN = 6 V 1.49 1.81 V
RT/CLK low threshold VVIN = 6 V 0.63 1.02 V
PWM DIMMING (PDIM)
IPDIM PDIM source current VPDIM = 0 1.04 µA
VIH High-level input voltage 1.34 1.45 V
VIL Low-level input voltage 0.79 0.88

7.6 Timing Requirements

MIN NOM MAX UNIT
TIMING RESISTOR AND EXTERNAL CLOCK (RT/CLK)
RT/CLK falling edge to PH rising edge delay Measured at 500 kHz with RT resistor in series, VVIN = 6 V 92.1 ns
Phase loop (PLL) lock-in time fSW = 500 kHz 100 µs
PWM DIMMING (PDIM)
tRISE Rising propagation delay 305 ns
tFALL Falling propagation delay 535

7.7 Typical Characteristics

VIN = 24V, Unless otherwise specified
TPS92512 TPS92512HV D003_SLVSCT1.gif
1.5 A LED Current 4 LEDs in Series VIADJ = 1.8 V
fSW = 570 kHz VOUT = 13.1 V
Figure 1. Efficiency vs Input Voltage
TPS92512 TPS92512HV D001_SLVSCT1.gif
Figure 3. Switching Frequency vs RT Resistor
TPS92512 TPS92512HV D006_SLVSCT1.gif
1.5 A LED Current 3 LEDs in Series
VOUT = 9.9 V
Figure 5. LED Current vs IADJ Voltage
TPS92512 TPS92512HV D008_SLVSCT1.gif
VIN = 12 V
Figure 7. PH Switch RDS(on) vs Junction Temperature
TPS92512 TPS92512HV D0010_SLVSCT1.gif
A.
VVIN = 12 V
Figure 9. Shutdown Input Current vs Junction Temperature
TPS92512 TPS92512HV D005_SLVSCT1.gif
1.5 A LED Current 3 LEDs in Series VIADJ = 1.8 V
VOUT = 9.9 V
Figure 2. Line Regulation
TPS92512 TPS92512HV D002_SLVSCT1.gif
Figure 4. Switching Frequency vs RT Resistor
TPS92512 TPS92512HV D007_SLVSCT1.gif
1.5 A LED Current 3 LEDs in Series VIADJ = 1.8 V
250 Hz PWM Frequency VOUT = 9.9 V
Figure 6. LED Current vs PDIM Duty Cycle
TPS92512 TPS92512HV D009_SLVSCT1.gif
VIADJ = 1.8 V
Figure 8. VISENSE vs Junction Temperature
TPS92512 TPS92512HV D0011_SLVSCT1.gif
A.
TJ = 25°C
Figure 10. Shutdown Input Current vs Input Voltage