SNVS900B DECEMBER   2012  – December 2015 TPS92560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Regulator
      2. 7.3.2 MOSFET Driver
      3. 7.3.3 ADJ Pin
        1. 7.3.3.1 Output OVP
      4. 7.3.4 AC1 and AC2 Pins
      5. 7.3.5 Detection of Power Source
      6. 7.3.6 Current Regulation
      7. 7.3.7 Switching Frequency (Boost Configuration)
      8. 7.3.8 Inductor Selection (Boost Configuration)
      9. 7.3.9 Input Surge Voltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Boost Application Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculate Values for the ADJ Resistors
          2. 8.2.1.2.2 Calculate the Sense Voltage and Sense Resistor Value
          3. 8.2.1.2.3 Calculate the Inductor Value
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Boost Application Circuit With LED Current Regulation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Application Curves
      3. 8.2.3 SEPIC Application Circuit With LED Current Regulation
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.