SLVSC76E February   2014  – May 2018 TPS92630-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Schematic
  5. 5 Revision History
  6. 6 Description (Continued)
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Constant LED-Current Setting
      2. 10.3.2 PWM Control
      3. 10.3.3 FAULT Diagnostics
      4. 10.3.4 Short-Circuit Detection
      5. 10.3.5 Open-Load Detection
      6. 10.3.6 Thermal Foldback
    4. 10.4 Device Functional Modes
      1. 10.4.1 Thermal Information
      2. 10.4.2 Operation With V(VIN) < 5 V (Minimum V(VIN))
      3. 10.4.3 Operation With 5 V < V(VIN) < 9 V (Lower-Than-Normal Automotive Battery Voltage)
  11. 11Applications and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Stoplight and Taillight Application With PWM Generator
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Step-by-Step Design Procedure
            1. 11.2.1.2.1.1 R(REF)
            2. 11.2.1.2.1.2 Duty Cycle
            3. 11.2.1.2.1.3 Input and Output Capacitors
        3. 11.2.1.3 PWM Dimming Application Curve
      2. 11.2.2 Simple Stop-Light and Taillight Application
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
          1. 11.2.2.2.1 Step-by-Step Design Procedure
            1. 11.2.2.2.1.1 R(REF)
            2. 11.2.2.2.1.2 R(Stop)
            3. 11.2.2.2.1.3 Input and Output Capacitors
      3. 11.2.3 Parallel Connection
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Procedure
          1. 11.2.3.2.1 Step-by-Step Design Procedure
            1. 11.2.3.2.1.1 R(REF)
            2. 11.2.3.2.1.2 Input and Output Capacitors
      4. 11.2.4 Alternate Parallel Connection
        1. 11.2.4.1 Design Requirements
        2. 11.2.4.2 Detailed Design Procedure
          1. 11.2.4.2.1 Step-by-Step Design Procedure
            1. 11.2.4.2.1.1 R(REF)
            2. 11.2.4.2.1.2 Input and Output Capacitors
      5. 11.2.5 High-Side PWM Dimming
        1. 11.2.5.1 Design Requirements
        2. 11.2.5.2 Detailed Design Procedure
          1. 11.2.5.2.1 Step-by-Step Design Procedure
            1. 11.2.5.2.1.1 Ratio of Resistors, R1 / R2
            2. 11.2.5.2.1.2 R1 and R2 Selection
            3. 11.2.5.2.1.3 Input and Output Capacitors
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Community Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.