The performance of any switching
converter depends as much on the layout of the PCB as the component selection. The
following guidelines can help design a PCB with the best power converter
performance.
- Place ceramic high-frequency bypass capacitors as close as possible to the TPS92643-Q1 VIN and PGND pins. Grounding for both the input and output capacitors must consist of localized top side planes that connect to the PGND pin.
- Place bypass capacitors for VCC close to the pins and ground the capacitors to device ground.
- Use wide traces for the
CBST capacitor and RBST resistor. Place
RBST and CBST network as close as possible to BST pin
and SW pin.
- Differentially route the CSP and CSN pins to sense resistor. Route the traces away from noisy nodes, preferably through a layer on the other side of a shielding/ground layer.
- Use ground plane in one of the middle layers for noise shielding.
- Make VIN and ground connection as wide as possible. This action reduces any
voltage drops on the input of the converter and maximizes efficiency.
- Keep switch area small. Keep the
copper area connecting the SW pin to the inductor as short and wide as possible.
At the same time, the total area of this node must be minimized to help reduce
radiated EMI.