SLUSCX8C March   2019  – March 2021 TPS92682-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Enable
      2. 7.3.2  Internal Regulator and Undervoltage Lockout (UVLO)
      3. 7.3.3  Oscillator
      4. 7.3.4  Spread Spectrum Function
      5. 7.3.5  Gate Driver
      6. 7.3.6  Rail-to-Rail Current Sense Amplifier
      7. 7.3.7  Transconductance Error Amplifier
      8. 7.3.8  Switch Current Sense
      9. 7.3.9  Slope Compensation
      10. 7.3.10 ILED Setting in CC Mode
      11. 7.3.11 Output Voltage Setting in CV Mode
      12. 7.3.12 PWM Dimming
      13. 7.3.13 P-Channel FET Gate Driver Output
      14. 7.3.14 Soft Start
      15. 7.3.15 Two-Phase Operation
        1. 7.3.15.1 Current Sharing In Two-Phase
      16. 7.3.16 Faults and Diagnostics
        1. 7.3.16.1  Main Fault Timer (MFT)
        2. 7.3.16.2  OV Fault
        3. 7.3.16.3  UV Fault
        4. 7.3.16.4  ILIM Fault
        5. 7.3.16.5  UVLO
        6. 7.3.16.6  ILED Over Current (OC)
        7. 7.3.16.7  ILED Undercurrent (UC)
        8. 7.3.16.8  ISNOPEN, FBOPEN, and RTOPEN Faults
        9. 7.3.16.9  TW and TSD
        10. 7.3.16.10 COMPx Pull-Down and Comp-Low signal
    4. 7.4 Device Functional Modes
      1. 7.4.1 POR Mode
      2. 7.4.2 Normal Operation
      3. 7.4.3 Limp Home
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Command Frame
      3. 7.5.3 Response Frame
        1. 7.5.3.1 Read Response Frame Format
        2. 7.5.3.2 Write Response Frame Format
        3. 7.5.3.3 Write Error/POR Frame Format
      4. 7.5.4 SPI Error
    6. 7.6 TPS92682 Registers
      1. 7.6.1  EN Register
      2. 7.6.2  CFG1 Register
      3. 7.6.3  CFG2 Register
      4. 7.6.4  SWDIV Register
      5. 7.6.5  ISLOPE Register
      6. 7.6.6  FM Register
      7. 7.6.7  SOFTSTART Register
      8. 7.6.8  CH1IADJ Register
      9. 7.6.9  CH2IADJ Register
      10. 7.6.10 PWMDIV Register
      11. 7.6.11 CH1PWML Register
      12. 7.6.12 CH1PWMH Register
      13. 7.6.13 CH2PWML Register
      14. 7.6.14 CH2PWMH Register
      15. 7.6.15 ILIM Register
      16. 7.6.16 IFT Register
      17. 7.6.17 MFT Register
      18. 7.6.18 FLT1 Register (read only)
      19. 7.6.19 FLT2 Register (read only)
      20. 7.6.20 FEN1 Register
      21. 7.6.21 FEN2 Register
      22. 7.6.22 FLATEN Register
      23. 7.6.23 OV Register
      24. 7.6.24 LHCFG Register
      25. 7.6.25 LHCH1IADJ Register
      26. 7.6.26 LHCH2IADJ Register
      27. 7.6.27 LHCH1PWML Register
      28. 7.6.28 LHCH1PWMH Register
      29. 7.6.29 LHCH2PWML Register
      30. 7.6.30 LHCH2PWMH Register
      31. 7.6.31 LHILIM Register
      32. 7.6.32 LHIFT Register
      33. 7.6.33 LHMFT Register
      34. 7.6.34 LHFEN1 Register
      35. 7.6.35 LHFEN2 Register
      36. 7.6.36 LHFLATEN Register
      37. 7.6.37 LHOV Register
      38. 7.6.38 CAL Register
      39. 7.6.39 RESET Register
  8. Application and Implementation
    1. 8.1 Application Information General Design Considerations
      1. 8.1.1 Switching Frequency, fSW
      2. 8.1.2 Duty Cycle Considerations
      3. 8.1.3 Main Power MOSFET Selection
      4. 8.1.4 Rectifier Diode Selection
      5. 8.1.5 Switch Current Sense Resistor
      6. 8.1.6 Slope Compensation
      7. 8.1.7 Soft Start
    2. 8.2 Application Information CC Mode
      1. 8.2.1 Inductor Selection
      2. 8.2.2 Output Capacitor Selection
      3. 8.2.3 Input Capacitor Selection
      4. 8.2.4 Programming LED Current
      5. 8.2.5 Feedback Compensation
      6. 8.2.6 Overvoltage and Undervoltage Protection
      7. 8.2.7 Series P-Channel MOSFET Selection
      8. 8.2.8 Programming Example for Two-Channel CC Mode
    3. 8.3 Typical Application CV Mode
      1. 8.3.1 Inductor Selection
      2. 8.3.2 Output Capacitor Selection
      3. 8.3.3 Input Capacitor Selection
      4. 8.3.4 Programming Output Voltage VOUT
      5. 8.3.5 Feedback Compensation
      6. 8.3.6 Overvoltage and Undervoltage Protection
      7. 8.3.7 Programing Example for Two-Phase CV BOOST
    4. 8.4 Typical Application CC Mode
      1. 8.4.1 CC Boost Design Requirements
      2. 8.4.2 CC Boost Detailed Design Procedure
        1. 8.4.2.1  Calculating Duty Cycle
        2. 8.4.2.2  Setting Switching Frequency
        3. 8.4.2.3  Setting Dither Modulation Frequency
        4. 8.4.2.4  Inductor Selection
        5. 8.4.2.5  Output Capacitor Selection
        6. 8.4.2.6  Input Capacitor Selection
        7. 8.4.2.7  Main N-Channel MOSFET Selection
        8. 8.4.2.8  Rectifier Diode Selection
        9. 8.4.2.9  Setting ILED and Selecting RCS
        10. 8.4.2.10 Setting Switch Current Limit
        11. 8.4.2.11 Slope Compensation
        12. 8.4.2.12 Compensator Parameters
        13. 8.4.2.13 Overvoltage Protection
        14. 8.4.2.14 Series P-Channel MOSFET Selection
      3. 8.4.3 CC Buck-Boost Design Requirements
      4. 8.4.4 CC Buck-Boost Detailed Design Procedure
        1. 8.4.4.1  Calculating Duty Cycle
        2. 8.4.4.2  Setting Switching Frequency
        3. 8.4.4.3  Setting Dither Modulation Frequency
        4. 8.4.4.4  Inductor Selection
        5. 8.4.4.5  Output Capacitor Selection
        6. 8.4.4.6  Input Capacitor Selection
        7. 8.4.4.7  Main N-Channel MOSFET Selection
        8. 8.4.4.8  Rectifier Diode Selection
        9. 8.4.4.9  Setting ILED and Selecting RCS
        10. 8.4.4.10 Setting Switch Current Limit
        11. 8.4.4.11 Slope Compensation
        12. 8.4.4.12 Compensator Parameters
        13. 8.4.4.13 Overvoltage Protection
      5. 8.4.5 PWM Dimming Consideration
      6. 8.4.6 Application Curves
    5. 8.5 Typical Application CV Mode
      1. 8.5.1 CV Design Requirements
      2. 8.5.2 Detailed Design Procedure
        1. 8.5.2.1  Calculating Duty Cycle
        2. 8.5.2.2  Setting Switching Frequency
        3. 8.5.2.3  Setting Dither Modulation Frequency
        4. 8.5.2.4  Inductor Selection
        5. 8.5.2.5  Output Capacitor Selection
        6. 8.5.2.6  Input Capacitor Selection
        7. 8.5.2.7  Main N-Channel MOSFET Selection
        8. 8.5.2.8  Rectifier Diode Selection
        9. 8.5.2.9  Programming VOUT
        10. 8.5.2.10 Setting Switch Current Limit
        11. 8.5.2.11 Slope Compensation
        12. 8.5.2.12 Compensator Parameters
        13. 8.5.2.13 Overvoltage Protection
      3. 8.5.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Serial Interface

The SPI bus consists of four signals: SSN, SCK, MOSI, and MISO. The SSN, SCK, and MOSI pins are TTL inputs into the TPS92682-Q1 while the MISO pin is an open-drain output. The SPI bus can be configured for both star-connect and daisy chain hardware connections.

A bus transaction is initiated by the MCU creating a falling edge on SSN. While SSN is low, the input data present on the MOSI pin is sampled on the rising edge of SCK, with MS-bit first. The output data is asserted on the MISO pin at the falling edge of the SCK. Figure 7-22 shows the data transition and sampling edges of SCK.

GUID-FEF5F391-E506-4B03-AC1F-6DAAA8B32AB4-low.gifFigure 7-22 SPI DATA Format

A valid transfer requires a non-zero integer multiple of 16 SCK cycles (16, 32, 48, and so forth). If SSN is pulsed low and no SCK pulses are issued before SSN rises, a SPI error is reported. Similarly, if SSN is raised before the 16th rising edge of SCK, the transfer is aborted and a SPI error is reported. If SSN is held low after the 16th falling edge of SCK and additional SCK edges occur, the data continues to flow through the TPS92682-Q1 shift register and out of the MISO pin. When SSN transitions from low-to-high, the internal digital block decodes the most recent 16 bits that were received prior to the SSN rising edge.

SSN must transition to high after a multiple of 16 SCK cycles for a transaction to be valid and does not set the SPI error bit. In the case of a write transaction, the TPS92682-Q1 logic performs the requested operation when SSN transitions high. In the case of a read transaction, the read data is output during the next frame, regardless of whether a SPI error has occurred.

The data bit on MOSI is shifted into an internal 16-bit shift register (MS-bit first) while data is simultaneously shifted out of the MISO pin. While SSN is high (bus idle), MISO is tri-stated by the open-drain driver. While SSN is low, MISO is driven according to the 16-bit data pattern being shifted out based on the prior received command. At the falling edge of the SSN, to begin a new transaction, MISO is driven with the MS-bit of the outbound data, and is updated on each subsequent falling edge of SCK.