DLPS133B June   2019  – July 2024 TPS99001-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics—Analog to Digital Converter
    6. 5.6  Electrical Characteristics—Voltage Regulators
    7. 5.7  Electrical Characteristics—Temperature and Voltage Monitors
    8. 5.8  Electrical Characteristics—Current Consumption
    9. 5.9  Power-Up Timing Requirements
    10. 5.10 Power-Down Timing Requirements
    11. 5.11 Timing Requirements—Sequencer Clock
    12. 5.12 Timing Requirements—Host and Diagnostic Port SPI Interface
    13. 5.13 Timing Requirements—ADC Interface
    14. 5.14 Switching Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog to Digital Converter
        1. 6.3.1.1 Analog to Digital Converter Input Table
      2. 6.3.2 Power Sequencing and Monitoring
        1. 6.3.2.1 Power Monitoring
      3. 6.3.3 DMD Mirror Voltage Regulator
      4. 6.3.4 Low Dropout Regulators
      5. 6.3.5 System Monitoring Features
        1. 6.3.5.1 Windowed Watchdog Circuits
        2. 6.3.5.2 Die Temperature Monitors
        3. 6.3.5.3 External Clock Ratio Monitor
      6. 6.3.6 Communication Ports
        1. 6.3.6.1 Serial Peripheral Interface (SPI)
    4. 6.4 Device Functional Modes
      1. 6.4.1 OFF
      2. 6.4.2 STANDBY
      3. 6.4.3 POWERING_DMD
      4. 6.4.4 DISPLAY_RDY
      5. 6.4.5 PARKING
      6. 6.4.6 SHUTDOWN
    5. 6.5 Register Maps
      1. 6.5.1 System Status Registers
      2. 6.5.2 ADC Control
      3. 6.5.3 General Fault Status
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Headlight
        1. 7.2.1.1 Design Requirements
  9. Power Supply Recommendations
    1. 8.1 TPS99001-Q1 Power Supply Architecture
    2. 8.2 TPS99001-Q1 Power Outputs
    3. 8.3 Power Supply Architecture
  10. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Power/High Current Signals
      2. 9.1.2 Sensitive Analog Signals
      3. 9.1.3 High-Speed Digital Signals
      4. 9.1.4 Kelvin Sensing Connections
      5. 9.1.5 Ground Separation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

High-Speed Digital Signals

The TPS99001-Q1 has three serial interfaces that transmit data into and out of the device. All of these interfaces have a maximum clock speed of 30MHz. To help prevent high levels of EMI emissions, these signals should be laid out with impedance-matched, low-inductance traces. In particular, the three clocks for these interfaces should be low inductance, and if a cable or a connector is used, the clock signal should be adjacent to the ground signal return.

Table 9-4 SPI1 Interface from DLPC23x-Q1 to TPS99001-Q1
PINNAMEFUNCTION
27SPI1_CLKClock (30MHz)
28SPI1_SS_ZSecondary Select
29SPI1_DOUTData
30SPI1_DINData
Table 9-5 SPI2 Interface from Customer MCU to TPS99001-Q1
PINNAMEFUNCTION
31SPI2_DINData
32SPI2_DOUTData
33SPI2_SS_ZSecondary Select
34SPI2_CLKClock (up to 30MHz)
Table 9-6 ADC3 Interface from DLPC23x-Q1 to TPS99001-Q1
PINNAMEFUNCTION
4ADC_MISOData
5ADC_MOSIData
17SEQ_CLKClock (30MHz)

To avoid crosstalk, a PCB trace spacing requirement is suggested, such as the “3 W rule” which specifies that if the trace width is 5 mils, then traces should be spaced out at least 15 mils from center to center. On TI’s PCB design, the typical trace spacing was 20 mils.