SNVSCB9A march 2023 – april 2023 TPSF12C1
PRODUCTION DATA
Figure 9-2 shows a schematic diagram of a 3-kW high-density server rack power supply with conventional two-stage passive EMI filter. The CM chokes and Y-capacitors provide CM filtering, whereas the leakage inductance of the CM chokes and the X-capacitors achieve DM attenuation. Similar to TI reference designs PMP23069, TIDA-010062 and PMP41006, the circuit uses a single-phase bridgeless power-factor correction (PFC) front-end. The DC/DC stage, which provides galvanic isolation and step-down voltage regulation, is a phase-shift full-bridge (PSFB) topology with fixed switching frequency. Alternatively, the DC/DC stage may be an LLC-based topology with variable switching frequency.
In this particular example, the TTPL PFC stage and isolated DC/DC stage run at fixed switching freqeuncies of 100 kHz and 200 kHz, respectively. Even though the use of GaN power switches (such as LMG3522-Q1 with top-side cooling) enables a high power density, the conventional passive EMI filter still occupies at least 20% of the overall solution size.
Note that the DC/DC stage in particular increases the CM EMI signature based on the high dv/dt of the GaN switches, the transformer interwinding capacitance as well as the various switch-node parasitic capacitances to chassis ground.
This application example replaces the two Y-capacitors, designated as CY3 and CY4 in Figure 9-2, with a single-phase AEF circuit using the TPSF12C1. See Figure 9-3. The AEF circuit provides capacitive multiplication of the inject capacitor, which reduces the CM inductance values and thus the size, weight, and cost of the CM chokes, now designated as LCM1-AEF and LCM2-AEF. The total capacitance of the sense and inject capacitors is kept similar to that of the replaced Y-capacitors, which results in the line-frequency leakage current remaining effectively unchanged.