SNVSCB9A march   2023  – april 2023 TPSF12C1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Active EMI Filtering
        1. 8.3.1.1 Schematics
      2. 8.3.2 Capacitive Amplification
      3. 8.3.3 Integrated Line Rejection Filter
      4. 8.3.4 Compensation
      5. 8.3.5 Remote Enable
      6. 8.3.6 Supply Voltage UVLO Protection
      7. 8.3.7 Thermal Shutdown Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – AEF Circuit for a High-Density 3-kW Server Rack Power Supply
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Sense Capacitors
          2. 9.2.1.2.2 Inject Capacitor
          3. 9.2.1.2.3 Compensation Network
          4. 9.2.1.2.4 Injection Network
          5. 9.2.1.2.5 Surge Protection
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1.2 Detailed Design Procedure

Table 9-2 gives the selected component values, which are the same as those used in the TPSF12C1 EVM. This design uses a TVS diode placed at the low-voltage side of the inject capacitor for clamping during input surge conditions.

Table 9-2 AEF Circuit Components for Application Circuit 1
REFERENCE DESIGNATOR QTY SPECIFICATION MANUFACTURER(1) PART NUMBER
CSEN1, CSEN2(2) 2 Capacitor, ceramic, 680 pF, 300 VAC, Y2 MuRata DE2B3SA681KN3AX02F
CINJ(2) 1 Capacitor, ceramic, 4.7 nF, 300 VAC, Y2 MuRata DE2E3SA472MA3BX02F
CD1(2) 1 Capacitor, ceramic, 4.7 nF, 50 V, 0603 Various –
CD2(2) 1 Capacitor, ceramic, 22 nF, 50 V, 0603 Various –
CD3 1 Capacitor, ceramic, 4.7 nF, 50 V, 0603 Various –
CG1 1 Capacitor, ceramic, 10 nF, 50 V, 0603 Various –
CG2 1 Capacitor, ceramic, 10 pF, 50 V, 0603 Various –
CVDD 1 Capacitor, ceramic, 1 µF, 25 V, X7R, 0603 Various –
DINJ 1 TVS diode, bidirectional, 24 V, SOD-323 Eaton STS321240B301
RD1 1 Resistor, 1 kΩ, 0.1 W, 0603 Various –
RD1A 1 Resistor, 50 Ω, 0.1 W, 0603 Various –
RD2 1 Resistor, 200 Ω, 0.1 W, 0603 Various –
RD3 1 Resistor, 698 Ω, 0.1 W, 0603 Various –
RG 1 Resistor, 1.5 kΩ, 0.1 W, 0603 Various –
U1 1 TPSF12C1 common-mode AEF IC for single-phase AC power systems Texas Instruments TPSF12C1DYYR
(2) Check the effective capacitance value based on the applied voltage and operating temperature.

More generally, the TPSF12C1 AEF IC is designed to operate with a wide range of passive filter components and system parameters.