SNVSCB8A march   2023  – april 2023 TPSF12C3

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Active EMI Filtering
        1. 8.3.1.1 Schematics
      2. 8.3.2 Capacitive Amplification
      3. 8.3.3 Integrated Line Rejection Filter
      4. 8.3.4 Compensation
      5. 8.3.5 Remote Enable
      6. 8.3.6 Supply Voltage UVLO Protection
      7. 8.3.7 Thermal Shutdown Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – AEF Circuit for Grid Infrastructure Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Sense Capacitors
          2. 9.2.1.2.2 Inject Capacitor
          3. 9.2.1.2.3 Compensation Network
          4. 9.2.1.2.4 Injection Network
          5. 9.2.1.2.5 Surge Protection
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

The following list summarizes the essential guidelines for PCB layout and component placement to optimze AEF performance. Figure 9-9 and Figure 9-10 show a recommended layout for the TPSF12C3 circuit specifically with optimized placement and routing of the IC and small-signal components. Figure 9-11 shows an example of a three-phase, four-wire filter board design with CM chokes, X-capacitors, Y-capacitors, protection components (varistors and X-capacitor discharge resistors), and AEF circuit.

  • Position the sense and inject capacitors between the CM chokes near the X-capacitor that couples the injected signal to the other power lines. Avoid placement close to the CM choke windings that may result in parasitic coupling to the sense and inject capacitors.
  • Maintain adequate clearance spacing between high-voltage and low-voltage traces. As an example, Figure 9-11 has 150 mils (3.8 mm) copper-to-copper spacing from power lines (lives and neutral) to chassis ground.
  • Route the sense lines S1, S2, S3 and S4 away from the INJ line. Avoid coupling between the sense and inject traces.
  • Use a solid ground connection between the TPSF12C3 and the filter board. Minimize parasitic inductance from the AEF circuit return to the chassis ground connections on the board.
  • Place a ceramic capacitor close to VDD and IGND. Minimize the loop area to the VDD and IGND pins.
  • Place the compensation network copnponents close to the COMP1 and COMP2 pins. Reduce noise sensitivity of the feedback compensation network path by placing components RG, CG1 and CG2 close to the COMP pins. COMP2 is the inverting input to the AEF anplifier and represents a high-impedance node sensitive to noise.
  • Provide enough PCB area for proper heatsinking. Use sufficient copper area to acheive a low thermal impedance. Provide adequate heatsinking for the TPSF12C3 to keep the junction temperature below 150°C. A top-side ground plane is an important heat-dissipating area. Use several heat-sinking vias to connect REFGND (pin 9) and IGND (pin 14) to ground copper on other layers.