SLVSFJ7D
november 2021 – august 2023
TPSI3050-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Power Ratings
6.6
Insulation Specifications
6.7
Safety-Related Certifications
6.8
Safety Limiting Values
6.9
Electrical Characteristics
6.10
Switching Characteristics
6.11
Insulation Characteristic Curves
6.12
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Transmission of the Enable State
8.3.2
Power Transmission
8.3.3
Gate Driver
8.3.4
Modes Overview
8.3.5
Three-Wire Mode
8.3.6
Two-Wire Mode
8.3.7
VDDP, VDDH, and VDDM Undervoltage Lockout (UVLO)
8.3.8
Power Supply and EN Sequencing
8.3.9
Thermal Shutdown
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Two-Wire or Three-Wire Mode Selection
9.2.2.2
Standard Enable, One-Shot Enable
9.2.2.3
CDIV1, CDIV2 Capacitance
9.2.2.4
RPXFR Selection
9.2.2.5
CVDDP Capacitance
9.2.2.6
Gate Driver Output Resistor
9.2.2.7
Start-up Time and Recovery Time
9.2.2.8
Supplying Auxiliary Current, IAUX From VDDM
9.2.2.9
VDDM Ripple Voltage
9.2.3
Application Curves
9.2.4
Insulation Lifetime
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Related Links
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DWZ|8
MPSS140
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsfj7d_oa
slvsfj7d_pm
10.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.