SLVSFJ7D november 2021 – august 2023 TPSI3050-Q1
PRODUCTION DATA
THERMAL METRIC(1) | DEVICE | UNIT | |
---|---|---|---|
DWZ(SOIC) | |||
8 PINS | |||
RϴJA | Junction-to-ambient thermal resistance | 89.3 | °C/W |
RϴJC(top) | Junction-to-case (top) thermal resistance | 40.3 | °C/W |
RΘJB | Junction-to-board thermal resistance | 45.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 10.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 44.4 | °C/W |